Canister housing
View Patent ↗According to one embodiment, a housing for a pedestal canister includes a first side plate and a fan. The first side plate includes a plurality of fins disposed on an exterior portion of the first side plate. The fan is coupled to the exterior portion of the first side plate. The pedestal canister is configured to be disposed within a pedestal aperture of a pedestal mounting block.
1. A housing for a pedestal canister, the housing comprising:
a first side plate, the first side plate comprising a plurality of fins disposed on an exterior portion of the first side plate; and
a fan, the fan coupled to the exterior portion of the first side plate;
wherein the pedestal canister is configured to be disposed within a pedestal aperture of a pedestal mounting block.
2. The housing of claim 1 , wherein an incoming air surface of the fan is closer to the interior of the housing than an outermost surface of the exterior portion of the first side plate.
3. The housing of claim 1 , wherein an incoming air surface of the fan is level with an outermost surface of the exterior portion of the first side plate.
4. The housing of claim 1 , wherein the first side plate has a surface that defines a cut out, the fan disposed within the cut out.
5. The housing of claim 1 , wherein a processor is mounted to an interior surface of the first side plate.
6. The housing of claim 1 , wherein a plurality of power modules are mounted to an interior surface of the first side plate.
7. The housing of claim 1 , further comprising:
a second side plate, the second side plate substantially parallel to the first side plate; and
a plurality of fins disposed on an exterior portion of the second side plate.
8. The housing of claim 1 , further comprising:
an upper plate;
a lower plate, the lower plate substantially parallel to the upper plate;
a second side plate, the second side plate substantially parallel to the first side plate;
and a mounting plate, the mounting plate coupled to the housing and configured to mount the pedestal canister to the mounting block.
9. The housing of claim 1 , wherein the first side plate comprises a thermal conductor.
10. The housing of claim 1 , wherein the first side plate is configured to absorb thermal energy generated by a processor.
11. The housing of claim 1 , wherein the first side plate is configured to absorb thermal energy generated by a power module.
12. The housing of claim 1 , wherein:
a processor is mounted to an interior surface of the first side plate; and
a plurality of power modules are mounted to the interior surface of the first side plate.