Microelectronic imaging units
View Patent ↗Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut.
1. A microelectronic imaging unit, comprising:
a support member including a base, a plurality of sidewalls projecting upward from the base, a recess defined by a space between the sidewalls and the base, and a plurality of terminals in the base and/or the sidewalls;
an imaging die mounted in the recess and attached to the base, the imaging die including an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
a cover attached to the imaging die and positioned over the image sensor;
a plurality of wire-bonds electrically connecting the external contacts of the imaging die to corresponding terminals on the support member; and
fill material in the recess between sides of the imaging die and the sidewalls.
2. The imaging unit of claim 1 , further comprising a dam positioned over the imaging die, the dam forming a perimeter around the cover.
3. The imaging unit of claim 1 wherein:
the cover comprises a plurality of ends; and
the imaging unit further comprises a dam on the imaging die, the dam at least partially encapsulating the ends of the cover.
4. The imaging unit of claim 1 , further comprising an adhesive attaching the cover to the die, the adhesive being disposed outboard the image sensor and defining a cell between the cover and the die.
5. The imaging unit of claim 1 , further comprising an adhesive attaching the cover to the die, the adhesive forming a perimeter around the image sensor.
6. The imaging unit of claim 1 , further comprising an adhesive attaching the cover to the die, the adhesive being disposed between the image sensor and the cover.
7. The imaging unit of claim 1 , further comprising an adhesive attaching the cover to the die, the adhesive being disposed outboard the image sensor and inboard the external contacts.
8. The imaging unit of claim 1 wherein the cover is inboard the external contacts.
9. The imaging unit of claim 1 wherein the sidewalls are attached to the base.
10. The imaging unit of claim 1 wherein the sidewalls and the base are a unitary member.
11. A microelectronic imaging unit, comprising:
a support member including a base, a plurality of sidewalls projecting upward from the base, a recess defined by a space between the sidewalls and the base, and a plurality of terminals in the base and/or the sidewalls;
an imaging die mounted in the recess and attached to the base, the imaging die including an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
a dam positioned over the imaging die forming a perimeter around the cover;
a cover disposed within the perimeter formed by the dam and secured over the image sensor by the dam;
a plurality of wire-bonds electrically connecting the external contacts of the imaging die to corresponding terminals on the support member; and
fill material in the recess between the imaging die and the sidewalls.
12. The imaging unit of claim 11 , wherein the cover is secured over the image sensor without an adhesive between the cover and the die.
13. The imaging unit of claim 11 , wherein the fill material extends from a bottom of the recess to a top of the dam.
14. The imaging unit of claim 11 , wherein the dam is formed over the external contacts of the imaging die.
15. The imaging unit of claim 14 , wherein the wire-bonds are disposed entirely within the dam and the fill material.
16. The imaging unit of claim 1 , wherein the fill material extends from a bottom of the recess to at least a top surface of the die.
17. The imaging unit of claim 2 , wherein the fill material extends from a bottom of the recess to a top of the dam.