IP Library Granted Patent US 8,014,127
Granted Patent B2
US 8,014,127 · App. 12/370,748 · Granted Sep 6, 2011

Solid electrolytic capacitor

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Quick Facts
Patent No.
US 8,014,127
App. No.
12/370,748
Granted
Sep 6, 2011
Kind
B2
Abstract

In a solid electrolytic capacitor, a capacitor element laminate formed by stacking capacitor elements each using a valve metal as an anode body is bonded to a substrate by a conductive adhesive and packaged by a resin portion. The substrate includes a printed substrate made of an epoxy resin. On its mounting surface for the capacitor element laminate, there are provided an anode mounting portion and a cathode mounting portion each made of a copper base material. The anode mounting portion and the cathode mounting portion are electrically connected to an external anode terminal and an external cathode terminal, respectively, formed on the mounting surface of the solid electrolytic capacitor, through anode vias and cathode vias each penetrating through the epoxy resin. A part of the anode mounting portion on the substrate ( 6 ) extends to the outside of the packaging resin portion.

Claims (14)

1. A solid electrolytic capacitor in which a capacitor element is mounted on a substrate and covered with a packaging resin,

wherein said capacitor element comprises an anode portion formed by a partial region of a valve metal base, a dielectric layer in the form of an oxide film formed at a roughened surface of said valve metal base and separated from said anode portion by an insulator portion, and a cathode portion including a conductive polymer layer and a conductor layer formed in this order on said dielectric layer, and

a path for water vapor or water molecules leading from the outside to the inside of said solid electrolytic capacitor is formed between said packaging resin and a surface of said substrate.

2. A solid electrolytic capacitor according to claim 1 , wherein said path leads to said anode portion of said capacitor element from the outside of said solid electrolytic capacitor through a part of the surface of said substrate.

3. A solid electrolytic capacitor according to claim 2 , wherein an anode mounting portion formed on a capacitor element mounting surface of said substrate has at least one portion that is formed to an external end face of said packaging resin and exposed at said external end face.

4. A solid electrolytic capacitor according to claim 3 , wherein a surface portion of said anode mounting portion of said substrate is made of a metal material containing, as a main component, one of gold, nickel, chromium, tin, silver, and copper.

5. A solid electrolytic capacitor according to claim 1 , wherein said path leads to said cathode portion of said capacitor element from the outside of said solid electrolytic capacitor through a part of the surface of said substrate.

6. A solid electrolytic capacitor according to claim 5 , wherein a cathode mounting portion formed on a capacitor element mounting surface of said substrate has at least one portion that is formed to an external end face of said packaging resin and exposed at said external end face.

7. A solid electrolytic capacitor according to claim 6 , wherein a surface portion of said cathode mounting portion of said substrate is made of a metal material containing, as a main component, one of gold, nickel, chromium, tin, silver, and copper.

8. A solid electrolytic capacitor according to claim 1 , wherein said path comprises a path leading to said anode portion of said capacitor element from the outside of said solid electrolytic capacitor through a part of the surface of said substrate and a path leading to said cathode portion of said capacitor element from the outside of said solid electrolytic capacitor through a part of the surface of said substrate.

9. A solid electrolytic capacitor according to claim 8 , wherein an anode mounting portion formed on a capacitor element mounting surface of said substrate has at least one portion that is formed to an external end face of said packaging resin and exposed at said external end face and a cathode mounting portion formed on the capacitor element mounting surface of said substrate has at least one portion that is formed to an external end face of said packaging resin and exposed at said external end face.

10. A solid electrolytic capacitor according to claim 9 , wherein a surface portion of said anode mounting portion of said substrate is made of a metal material containing, as a main component, one of gold, nickel, chromium, tin, silver, and copper.

11. A solid electrolytic capacitor according to claim 9 , wherein a surface portion of said cathode mounting portion of said substrate is made of a metal material containing, as a main component, one of gold, nickel, chromium, tin, silver, and copper.

12. A solid electrolytic capacitor according to claim 1 , wherein said valve metal base is made of one of aluminum, tantalum, niobium, titanium, hafnium, and zirconium.

Assignments (2)
CHANGE OF NAME Recorded Jun 19, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 042879/0135 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2009
From: KASUGA, TAKEO; MIZUKOSHI, TAKASHI; SAKATA, KOJI; SAITO, TAKESHI
To: NEC TOKIN CORPORATION
Reel/Frame 022260/0739 →