Method and device employing polysilicon scaling

1. A method of fabricating polysilicon lines of a memory, comprising:

forming a layered stack on a core section and a peripheral section of a substrate, wherein the layered stack includes a charge trapping component that is positioned on the core section and the peripheral section, and a core polysilicon layer that is positioned on the charge trapping component;

removing a portion of the layered stack that is located at the peripheral section, wherein removing the layered stack from the peripheral section includes removing the core polysilicon layer from the peripheral section;

forming a peripheral polysilicon layer on the peripheral section and the layered stack of the core section such that the peripheral polysilicon is thicker than the core polysilicon layer;

removing a portion of the peripheral polysilicon layer that is located on the layered stack of the core section; and

patterning individual polysilicon lines in the layered stack of the core section.

2. The method of claim 1 , wherein patterning individual polysilicon lines in the layered stack of the core section includes patterning at least one of a word line, a source select gate line, or a drain select gate line.

3. The method of claim 1 , further comprising forming one or more core memory cells that each include a portion of the individual polysilicon lines.

4. The method of claim 1 , further comprising pattering a gate stack by patterning the peripheral polysilicon layer of the peripheral section.

5. The method of claim 1 , further comprising:

employing a single mask layer to form a pattern in the individual polysilicon lines; and

employing one or more different mask layers to form another pattern in the peripheral polysilicon layer of the peripheral section.

6. The method of claim 1 , wherein forming the layered stack includes depositing the core polysilicon layer such that the core polysilicon layer has a thickness in a range of about 300 to 900 A, and wherein forming the peripheral poly silicon layer includes depositing the peripheral polysilicon layer such that the peripheral polysilicon layer has a thickness in a range of about 1000 to 2000 A.

7. The method of claim 1 , wherein forming individual word lines includes:

forming spacings in the layered stack;

implanting one or more surface portions of the substrate at locations that are defined by the spacings; and

forming a dielectric spacer layer that covers the implanted surface portions of the substrate.

8. The method of claim 1 , wherein forming the layered stack further includes forming a dielectric layer on the layered stack, and wherein isolating the layered stack includes employing the dielectric layer as an etch stop.

9. The method of claim 1 , further comprising:

prior to forming the layered stack, forming a hard mask that covers one or more features of the peripheral section of the substrate; and

subsequent to removing the portion of the layered stack, removing the hard mask by employing the layered stack as a protective mask.

10. The method of claim 1 , wherein forming the layered stack includes:

forming a silicon oxide layer on the substrate;

forming a silicon nitride layer on the silicon oxide layer;

forming another silicon oxide layer on the silicon nitride layer; and

forming the core polysilicon layer on the other silicon oxide layer.

11. A method of fabricating a memory, comprising:

defining the locations of individual word lines in a layered stack by forming spacings that open to one or more surface portions of a substrate;

forming source/drain regions by implanting the surface portions through the spacings;

covering the source/drain regions with a dielectric spacer layer;

fabricating one or more devices that are peripheral to the individual word lines while the source/drain regions are covered by the dielectric spacer layer,

forming a polysilicon layer on the layered stack; and

forming another polysilicon layer that is peripheral to the layered stack,

wherein the other polysilicon layer is thicker then the polysilicon layer.

12. The method of claim 11 , further comprising forming the layered stack by forming a charge trapping component on the substrate and a polysilicon layer on the charge trapping component.

13. The method of claim 11 , wherein covering the plurality of source/drain regions includes:

forming a liner layer in the spacings;

depositing a dielectric material on the layered stack, the source/drain regions, and the liner layer; and

planarizing the dielectric material.

14. The method of claim 11 , wherein fabricating the devices includes:

forming a polysilicon layer on a surface of the substrate that is peripheral to the individual word lines; and

patterning the polysilicon layer.