Methods for mounting an electro-optical component in alignment with an optical element and related structures
View Patent ↗Mounting an electro-optical component ( 1 ) on a carrier substrate ( 2 ) in an accurate position with respect to an optical element ( 6 ), the carrier substrate and the electro-optical component each being provided with at least one solder pad ( 3, 4 ). The solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on the electro-optical component in a direction (x) towards the optical element, and the structure is designed to allow said electro-optical component to move laterally during soldering, such that it is brought into abutment with said optical element, thereby ensuring an accurate relative positioning between the electro-optical component and the optical element.
1. A mounting structure comprising:
an electro-optical component to be mounted in alignment with an optical element, and
a carrier substrate, fixedly arranged with respect to said optical element, said carrier substrate and said electro-optical component each comprising at least one solder pad, wherein
said electro-optical component comprises an electro-optical die arranged on a submount,
said solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on said electro-optical component in a direction (x) towards said optical element, and
said structure is designed to allow said electro-optical component to move in said direction (x) during soldering, such that said submount is brought into abutment with said optical element.
2. The mounting structure according to claim 1 , wherein said submount and/or said optical element has a geometric form adapted to align said electro-optical component when brought into abutment with said optical element.
3. The mounting structure according to claim 2 , wherein said submount and said optical element define three contact points, such that, when said submount and said optical element they are brought into abutment with each other, the contact points facilitate alignment therebetween in a predetermined plane.
4. The mounting structure according to claim 2 , wherein said electro-optical component and said optical element are formed with notch and groove features, adapted to fit into each other when they are brought into contact.
5. The mounting structure according to claim 2 , wherein said optical element comprises a protrusion dimensioned and arranged so as to allow a portion of said electro-optical component to slide under said protrusion.
6. The mounting structure according to claim 1 , wherein said at least one solder pad disposed on the carrier substrate is laterally displaced in relation to the corresponding at least one solder disposed on said electro -optical component.
7. The mounting structure according to claim 1 , wherein said at least one solder pad arranged on said carrier substrate has a greater extension than the corresponding solder pad on said electro-optical component.
8. The mounting structure according to claim 5 , wherein said at least one solder pad on the carrier substrate extends under the protrusion of the optical element.
9. A method for mounting an electro-optical component in alignment with an optical element, said electro-optical component comprising an electro-optical die arranged on a submount, said method comprising soldering said electro-optical component onto a carrier substrate being fixedly arranged in relation to said optical element, using solder pads provided on said electro -optical component and said carrier substrate respectively, wherein said solder pads are positioned in relation to each other such that, when said electro-optical component is soldered onto the substrate, a force is generated that acts on said electro-optical component in a direction (x) towards said optical element, and wherein said electro-optical component is movable in said direction (x) during soldering, such that it is brought into abutment with said optical element.
10. The method according to claim 9 , wherein the positioning of said solder pads comprises laterally displacing the solder pads provided on said carrier substrate in relation to the corresponding pads provided on said electro -optical component.
11. The method according to claim 9 , wherein said optical element comprises a protrusion, the method further comprising sliding said electro-optical component under said protrusion during soldering.