Encapsulation for electronic and/or optoelectronic device
View Patent ↗A method of processing a flexible encapsulation scheme to encapsulate a flexible device, such as a display device in order to provide structural support for the display module. An upper transparent encapsulation layer covers and protects the media and active area of the device. A lower encapsulation layer is deposited over the under side of the display to complete the encapsulation and the two protective encapsulation layers are sealed. A driver housing may be positioned at the opposite end of the device to the overlap region of the encapsulation layers in order to protect the driver electronics.
1. A method of encapsulating one or more electronic and/or optoelectronic device elements supported on a substrate, wherein the method comprises,
providing a first barrier layer on a first side of the substrate,
applying a second, flexible single material, barrier layer to a second side of the substrate,
bending said second, flexible single material, barrier layer about at least one edge of the substrate,
wrapping said second, flexible single material, barrier layer up side walls of the substrate and around said first barrier layer, and
sealing the second, flexible single material, barrier layer to the first barrier layer.
2. A method according to claim 1 , wherein the said one or more electronic and/or optoelectronic device elements are provided on said first side of the substrate.
3. A method according to claim 2 , wherein said first barrier layer protects said one or more electronic and/or optoelectronic device elements against damage by oxygen and/or moisture and/or ultraviolet radiation, and wherein the method comprises bending said second, flexible single material, barrier layer about at least said portion of the substrate so as to overlap at least a portion of said first barrier layer over said substrate.
4. A method of encapsulating one or more electronic and/or optoelectronic device elements supported on a substrate, wherein the method comprises:
applying at least one flexible component to at least one side of opposite sides of the substrate,
bending said least one flexible component about at least one edge of the substrate, and
securing said at least one flexible component in such bent configuration wherein the substrate supports at a location adjacent to the one or more electronic and/or optoelectronic device elements drive electronics for driving the one or more electronic and/or optoelectronic device elements, and the method comprises covering said drive electronics with a housing extending over both said opposite sides of said substrate at at least an edge portion of said substrate and securing the housing to an outer side of the at least one flexible component.
5. A method according to claim 4 , wherein said at least one flexible component serves to protect the one or more electronic and/or optoelectronic device elements against damage by oxygen and/or moisture and/or ultraviolet radiation, and wherein securing the housing to an outer side of the at least one flexible component comprises using a sealant that also serves to protect the one or more electronic and/or optoelectronic device elements against damage by oxygen and/or moisture and/or ultraviolet radiation.
6. A method according to claim 4 , wherein the driver electronics are not covered by the said at least one flexible component to which the housing is secured.
7. A method of encapsulating one or more electronic and/or optoelectronic device elements supported on a substrate, wherein the method comprises,
providing a first barrier layer on a first side of the substrate,
applying a second, flexible, barrier layer to a second side of the substrate,
bending said second, flexible, barrier layer about at least one edge of the substrate,
wrapping said second, flexible, barrier layer around opposite surfaces of at least an edge portion of said first barrier layer, and
sealing the second, flexible, barrier layer to the first barrier layer at both said opposite surfaces of said first barrier layer.
8. A method according to claim 7 , wherein the said one or more electronic and/or optoelectronic device elements are provided on said first side of the substrate.