Modem, in particular for subsea power line communication
A modem, in particular for subsea power line communication, has electronic components on a circuit board, and a metal encapsulation, wherein the encapsulation forms at least two chambers separated by at least one wall, wherein each of the chambers surrounds at least one of the electronic components.
1. A modem comprising:
electronic components on a circuit board having a first side and an opposite second side, and
a metal encapsulation including:
a one-piece front frame arranged on the first side of the circuit board, the one-piece front frame including an outer perimeter wall and one or move internal walls within the outer perimeter,
a front cover distinct from and removably secured to the front frame,
a one-piece back frame arranged on the second side of the circuit board, the one-piece back frame including an outer perimeter wall and one or move internal walls within the outer perimeter, and
a back cover distinct from and removably secured to the back frame,
wherein the outer perimeter walls and the internal walls of the one-piece front frame and the one-piece back frame define at least three chambers, including:
a first chamber that surrounds analogue send and receive components, including a power amplifier arranged on the first side of the circuit board,
a second chamber that surrounds analogue-to-digital and digital-to-analogue components, and
a third chamber that surrounds a high-frequency digital signal processor, a field programmable gate array, and a DC/DC power supply, and
a metal body surrounding, but not contacting, the power amplifier component arranged on the first side of the circuit board, the metal body being distinct from the metal encapsulation and arranged within the first chamber defined by the metal encapsulation.
2. The modern according to claim 1 , wherein said chambers are arranged at a first side of said circuit board.
3. The modem according to claim 2 , wherein for at least one particular chamber, a corresponding mirrored chamber is implemented on an opposite side of said circuit board.
4. The modem according to claim 3 , wherein the circuit board separates said each of said at least one particular chamber from its corresponding mirrored chamber.
5. The modem according to claim 1 , wherein the at least one separating wall is in tight contact with said circuit board.
6. The modem according to claim 5 , wherein the circuit board is provided at its surface with at least one metal contact zone for the at least one separating wall.
7. The modem according to claim 1 , wherein one plane side of each of said frames is entirely in tight contact with said circuit board.
8. The modem according to claim 1 , wherein the encapsulation consists of aluminum.
9. The modem according to claim 1 , wherein the encapsulation has a least thickness of 2 mm.
10. The modem according to claim 1 , wherein the modem is a subsea power line communication modem.
11. A method for subsea power line communication, comprising the steps of:
providing a modem with electronic components on a circuit board having a first side and an opposite second side, and
providing a metal encapsulation including:
a one-piece front frame arranged on the first side of the circuit board, the one-piece front frame including an outer perimeter wall and one or move internal walls within the outer perimeter,
a front cover distinct from and removably secured to the front frame,
a one-piece back frame arranged on the second side of the circuit board, the one-piece back frame including an outer perimeter wall and one or move internal walls within the outer perimeter, and
a back cover distinct from and removably secured to the back frame,
such that the outer perimeter walls and the internal walls of the one-piece front frame and the one-piece back frame define at least three chambers, including:
a first chamber that surrounds analogue send and receive components including a power amplifier arranged on the first side of the circuit board,
a second chamber that surrounds analogue-to-digital and digital-to-analogue components, and
a third chamber that surrounds a high-frequency digital signal processor, a field programmable gate array, and a DC/DC power supply, and
providing a metal body surrounding, but not contacting, the power amplifier component arranged on the first side of the circuit board, the metal body being distinct from the one-piece front frame and arranged within the first chamber.
12. The method according to claim 11 , comprising the step of arranging said chambers at a first side of said circuit board.
13. The method according to claim 12 , wherein for at least one particular chamber, a corresponding mirrored chamber is implemented on an opposite side of said circuit board.
14. The method according to claim 13 , wherein the circuit board separates said each of said at least one particular chamber from its corresponding mirrored chamber.
15. The method according to claim 11 , wherein the at least one separating wall is in tight contact with said circuit board.
16. The method according to claim 15 , comprising the step of providing the circuit board at its surface with at least one metal contact zone the at least one separating wall.