Display device and manufacturing method thereof
Provided is a display device including a p-type thin film transistor formed on a substrate, in which the p-type thin film transistor includes: a gate electrode; a drain electrode; a source electrode; an insulating film; a semiconductor layer formed on a top surface of the gate electrode through the insulating film; and diffusion layers of p-type impurities formed at each of an interface between the drain electrode and the semiconductor layer and an interface between the source electrode and the semiconductor layer, the drain electrode and the source electrode being formed so as to be opposed to each other with a clearance formed therebetween on a top surface of the semiconductor layer.
1. A display device, comprising a p-type thin film transistor and an n-type thin film transistor which are formed on a substrate, wherein:
the p-type thin film transistor and the n-type thin film transistor each comprising:
a gate electrode;
a drain electrode;
a source electrode;
an insulating film; and
a semiconductor layer formed on a top surface of the gate electrode through the insulating film,
the drain electrode and the source electrode being formed so as to be opposed to each other with a clearance formed therebetween on a top surface of the semiconductor layer;
the semiconductor layer of the p-type thin film transistor has, at each of an interface with the drain electrode and an interface with the source electrode, diffusion layers of p-type impurities formed therein; and
the n-type thin film transistor further includes, at each of an interface between the drain electrode, which is formed in the same layer and is made of the same material as the drain electrode and the source electrode of the p-type thin film transistor, and the semiconductor layer and an interface between the source electrode, which is formed in the same layer and is made of the same material as the drain electrode and the source electrode of the p-type thin film transistor, and the semiconductor layer, semiconductor layers in which n-type impurities are doped.
2. The display device according to claim 1 , wherein the n-type thin film transistor further includes, at each of the interface between the drain electrode and the semiconductor layer and the interface between the source electrode and the semiconductor layer, diffusion barrier layers for preventing a material of the drain electrode and the source electrode from diffusing into the semiconductor layer, and wherein the semiconductor layers in which n-type impurities are doped and the diffusion barrier layers are respectively accumulated as a sequentially-laminated body.
3. The display device according to claim 1 , wherein the drain electrode and the source electrode are formed of, as a main material, any one material selected from the group consisting of aluminum, gallium, indium, and thallium, and the any one material is diffused into the semiconductor layer to form the diffusion layer of p-type impurities.
4. The display device according to claim 1 , wherein the semiconductor layer is formed of a polycrystalline semiconductor layer.
5. The display device according to claim 1 , wherein the semiconductor layer is formed of a sequentially-laminated body of a polycrystalline semiconductor layer and an amorphous semiconductor layer.
6. The display device according to claim 2 , wherein the drain electrode and the source electrode are formed of, as a main material, any one material selected from the group consisting of aluminum, gallium, indium, and thallium, and the any one material is diffused into the semiconductor layer to form the diffusion layer of p-type impurities.
7. The display device according to claim 2 , wherein the semiconductor layer is formed of a polycrystalline semiconductor layer.
8. The display device according to claim 2 , wherein the semiconductor layer is formed of a sequentially-laminated body of a polycrystalline semiconductor layer and an amorphous semiconductor layer.