IP Library Granted Patent US 8,844,609
Granted Patent B2
US 8,844,609 · App. 12/381,385 · Granted Sep 30, 2014

Cooling manifold

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Quick Facts
Patent No.
US 8,844,609
App. No.
12/381,385
Granted
Sep 30, 2014
Kind
B2
Abstract

Apparatus including cooling manifold, having metal cooling body and metal cooling block. Metal cooling body has internal passageway. Metal cooling block extends away from metal cooling body. Metal cooling block has surface oriented for being placed adjacent to and in substantially direct thermal communication with an electronic component located at distance away from metal cooling body. Cooling manifold is configured for circulating a working fluid through internal passageway and for precluding passage of the working fluid from metal cooling body into metal cooling block. Method that includes providing electronic component and cooling manifold. Provided cooling manifold includes metal cooling body and metal cooling block; metal cooling body has internal passageway; metal cooling block extends away from metal cooling body; metal cooling block has surface oriented adjacent to and in substantially direct thermal communication with electronic component being located at distance away from metal cooling body. Method also includes causing working fluid to be circulated through internal passageway while precluding passage of working fluid from metal cooling body into metal cooling block, such that heat is transferred from electronic component to working fluid.

Claims (31)

1. An apparatus, comprising a: cooling manifold, including a metal cooling body having a cavity and having an internal passageway that has a circuitous region adjacent to a portion of a wall of the cavity, and including a metal cooling block configured for being positioned with a portion of the metal cooling block in substantially direct thermal communication with the portion of the wall that is adjacent to the circuitious region while another portion of the metal cooling block is extending outside of the metal cooling body, the another portion of the metal cooling block having a surface oriented for being placed adjacent to and in substantially direct thermal communication with an electronic component located at a distance away from the metal cooling body;

wherein the metal cooling body including a plurality of fluid distribution plates; and wherein each of the plurality of fluid distribution plates has a first fluid input aperture, a first fluid output aperture, first and second spaced apart fluid collection regions communication through a circuitous flow region, the first fluid collection region communication with the first fluid input aperture, and the second fluid collection region communication with the first fluid output aperture; and wherein the circuitous flow region of one of the fluid distribution plates forms the circuitous region adjacent to the portion of the wall of the cavity;

wherein the metal cooling body includes a physical series of plate pairs, each of the series of plate pairs having a one of the plurality of fluid distribution plates and a one of a plurality of fluid reservoir plates, wherein each of the plurality of fluid reservoir plates has a fluid reservoir region, and wherein each of the series of plate pairs forms a portion of the internal passageway; and

wherein the cooling manifold is configured for circulating a working fluid through the internal passageway and for precluding passage of the working fluid from the metal cooling body into the metal cooling block.

2. The apparatus of claim 1 , wherein each of the plurality of fluid reservoir plates includes a second fluid input aperture and a second fluid output aperture both being spaced apart from the fluid reservoir region, wherein the first and second fluid input apertures of each of the series of plate pairs cooperate together to form another portion of the internal passageway, and wherein the first and second fluid output apertures of each of the series of plate pairs cooperate together to form a further portion of the internal passageway.

3. The apparatus of claim 2 , wherein each of the plurality of fluid distribution plates includes a third fluid input aperture and a third fluid output aperture both being spaced apart from the fluid collection regions and from the circuitous flow region, wherein a plurality of the third fluid input apertures cooperate together with the first and second fluid input apertures to form the another portion of the internal passageway, and wherein a plurality of the third fluid output apertures cooperate together with the first and second fluid output apertures to form the further portion of the internal passageway.

4. The apparatus claim 1 including an electronic component, the surface of the metal cooling block being oriented adjacent to and in substantially direct thermal communication with the electronic component.

5. The apparatus of claim 1 wherein the cooling manifold facilitates detachment of the metal cooling block from the metal cooling body.

6. The apparatus of claim 1 further including another metal cooling block, wherein the metal cooling body includes another cavity having another wall, and wherein the another metal cooling block is configured for being positioned with a portion of the another metal cooling block in substantially direct thermal communication with a portion of the another wall of the another cavity.

7. The apparatus of claim 6 , wherein an opening of the cavity faces away from the metal cooling body in a first direction, and wherein an opening of the another cavity faces away from the metal cooling body in a second direction different than the first direction.

8. An apparatus, comprising a: cooling manifold, including a metal cooling body having a cavity and having an internal passageway that has a circuitous region adjacent to a portion of a wall of the cavity, and including a metal cooling block configured for being positioned with a portion of the metal cooling block in substantially direct thermal communication with the portion of the wall that is adjacent to the circuitous region while another portion of the metal cooling block is extending outside of the metal cooling body, the another portion of the metal cooling block having a surface oriented for being placed adjacent to and in substantially direct thermal communication with an electronic component located at a distance away from the metal cooling body;

wherein the metal cooling body including a plurality of fluid distribution plates; and wherein each of the plurality of fluid distribution plates has a first fluid input aperture, a first fluid output aperture, first and second spaced apart fluid collection regions in communication through a circuitous flow region, the first fluid collection region communication with the first fluid input aperture, and the second fluid collection region communication with the first fluid output aperture; and wherein the circuitous flow region of one of the fluid distribution plates forms the circuitous region adjacent to the portion of the wall of the cavity;

wherein the metal cooling body has another cavity and includes a physical series of plate pairs, each of the series of plate pairs having a one of the plurality of fluid distribution plates and a one of a plurality of cavity plates, a one of the cavity plates forming the cavity and another one of the cavity plates forming the another cavity.

9. The apparatus of claim 1 , wherein the metal cooling body has another cavity, and wherein each of the series of plate pairs is physically adjacent to a one of a plurality of cavity plates, a one of the cavity plates forming the cavity and another one of the cavity plates forming the another cavity.

10. The apparatus of claim 8 , wherein each of the plurality of fluid distribution plates includes a third fluid input aperture and a third fluid output aperture both being spaced apart from the fluid collection regions and from the circuitous flow region, wherein a plurality of the third fluid input apertures cooperate together with the first and second fluid input apertures to form another portion of the internal passageway, and wherein a plurality of the third fluid output apertures cooperate together with the first and second fluid output apertures to form a further portion of the internal passageway.

11. The apparatus of claim 8 including an electronic component, the surface of the metal cooling block being oriented adjacent to and in substantially direct thermal communication with the electronic component.

12. The apparatus of claim 8 , wherein the cooling manifold facilitates detachment of the metal cooling block from the metal cooling body.

13. The apparatus of claim 8 , wherein an opening of the cavity faces away from the metal cooling body in a first direction, and wherein an opening of the another cavity faces away from the metal cooling body in a second direction different than the first direction.

14. An apparatus, comprising:

a cooling manifold, including a metal cooling body having an internal passageway, and including a plurality of metal cooling blocks;

the metal cooling body including a plurality of cavities each having a cavity wall, and including a physical series of plate pairs, each of the cavities being interposed between and located physically adjacent to two of the series of plate pairs;

each of the plate pairs forming a portion of the internal passageway, and including a fluid reservoir plate having a fluid reservoir region, and including a fluid distribution plate having a circuitous flow region adjacent to a portion of one of the cavity walls;

each of the fluid distribution plates having a first fluid input aperture, a first fluid output aperture, and first and second spaced apart fluid collection regions in communication through the circuitous flow region, the first fluid collection region communicating with the first fluid input aperture, and the second fluid collection region communicating with the first fluid output aperture;

wherein each of the metal cooling blocks is configured for being positioned with a portion of the metal cooling block in substantially direct thermal communication with the portion of one of the cavity walls that is adjacent to one of the circuitous flow regions while another portion of the metal cooling block is extending outside of the metal cooling body, the another portion of the metal cooling block having a surface oriented for being placed adjacent to and in substantially direct thermal communication with an electronic component located at a distance away from the metal cooling body;

wherein the cooling manifold is configured for circulating a working fluid through the internal passageway and for precluding passage of the working fluid from the metal cooling body into the metal cooling blocks.

15. The apparatus of claim 14 , wherein each of the fluid reservoir plates includes a second fluid input aperture and a second fluid output aperture both being spaced apart from the fluid reservoir region, wherein the first and second fluid input apertures of each of the series of plate pairs cooperate together to form another portion of the internal passageway, and wherein the first and second fluid output apertures of each of the series of plate pairs cooperate together to form a further portion of the internal passageway.

16. The apparatus of claim 15 , wherein each of the plurality of fluid distribution plates includes a third fluid input aperture and a third fluid output aperture both being spaced apart from the fluid collection regions and from the circuitous flow region, wherein a plurality of the third fluid input apertures cooperate together with the first and second fluid input apertures to form the another portion of the internal passageway, and wherein a plurality of the third fluid output apertures cooperate together with the first and second fluid output apertures to form the further portion of the internal passageway.

17. The apparatus of claim 14 including an electronic component, the surface of a one of the metal cooling blocks being oriented adjacent to and in substantially direct thermal communication with the electronic component.

18. The apparatus of claim 14 , wherein the cooling manifold facilitates detachment of the metal cooling blocks from the metal cooling body.

19. The apparatus of claim 14 , wherein an opening of a one of the cavities faces away from the metal cooling body in a first direction, and wherein an opening of another one of the cavities faces away from the metal cooling body in a second direction different than the first direction.

20. The apparatus of claim 14 , wherein the metal cooling body includes a plurality of cavity plates, a one of the plurality of cavity plates being physically adjacent to a one of the plate pairs, and another one of the plurality of cavity plates being physically adjacent to another one of the plate pairs.

Assignments (8)
SECURITY INTEREST Recorded Jun 1, 2021
From: WSOU INVESTMENTS, LLC
To: OT WSOU TERRIER HOLDINGS, LLC
Reel/Frame 056990/0081 →
RELEASE OF SECURITY INTEREST Recorded May 21, 2019
From: OCO OPPORTUNITIES MASTER FUND, L.P. (F/K/A OMEGA CREDIT OPPORTUNITIES MASTER FUND LP
To: WSOU INVESTMENTS, LLC
Reel/Frame 049246/0405 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2017
From: ALCATEL LUCENT
To: WSOU INVESTMENTS, LLC
Reel/Frame 044000/0053 →
SECURITY INTEREST Recorded Sep 21, 2017
From: WSOU INVESTMENTS, LLC
To: OMEGA CREDIT OPPORTUNITIES MASTER FUND, LP
Reel/Frame 043966/0574 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2014
From: CREDIT SUISSE AG
To: ALCATEL-LUCENT USA INC.
Reel/Frame 033949/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2014
From: ALCATEL-LUCENT USA INC.
To: ALCATEL LUCENT
Reel/Frame 033616/0042 →
SECURITY INTEREST Recorded Mar 7, 2013
From: ALCATEL-LUCENT USA INC.
To: CREDIT SUISSE AG
Reel/Frame 030510/0627 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2009
From: BYERS, CHARLES C.; SCOFIELD, WILLIAM H.
To: ALCATEL-LUCENT USA INC.
Reel/Frame 022425/0578 →