Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments
View Patent ↗A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
1. A method for manufacturing a connector, comprising:
providing a layer of conductive material and a first layer of a flexible insulator;
removing portions of said conductive material to form distinct conductive regions supported by said first layer of a flexible insulator;
adding a second layer of flexible insulator on at least said distinct conductive regions, wherein said distinct conductive regions are completely surrounded by insulating flexible material;
forming, for each of said distinct conductive regions, a hole through said first and second layers of flexible insulator and the corresponding distinct conductive region;
plating portions of said distinct conductive regions; and
attaching bent compliant leads to at least some of said distinct conductive regions.
2. The method of claim 1 , said attaching further comprising:
providing an array of leads connected to a common support;
applying at least one of solder paste or flux to said array of leads;
aligning said array of leads with corresponding ones of said distinct conductive regions;
heating at least said array of leads and said distinct conductive regions; and
removing said common support.
3. The method of claim 1 , further comprising:
providing a circuit board and at least one pin passing through said circuit board;
threading said at least one pin through corresponding ones of said holes; and
connecting at least some of said leads to said circuit board.
4. The method for manufacturing a connector of claim 1 , wherein said removing further comprises:
removing, for each of the distinct conductive regions, adjacent first and second areas of the first layer of flexible insulator;
said first area being substantially rectangular;
said second area being at least partially curved;
wherein said first and second areas collectively form a partial capsule shape.
5. The method for manufacturing a connector of claim 2 , wherein said removing further comprises:
removing, for each of the distinct conductive regions, adjacent first and second areas of the first layer of flexible insulator;
said first area being substantially rectangular;
said second area being at least partially curved;
wherein said first and second areas collectively form a partial capsule shape.
6. The method for manufacturing a connector of claim 3 , wherein said removing further comprises:
removing, for each of the distinct conductive regions, adjacent first and second areas of the first layer of flexible insulator;
said first area being substantially rectangular;
said second area being at least partially curved;
wherein said first and second areas collectively form a partial capsule shape.
7. The method of claim 1 , further comprising:
providing a circuit board and at least one pin passing through said circuit board without physically touching said circuit board;
threading said at least one pin through corresponding ones of said holes; and
connecting at least some of said leads to said circuit board.