Process of cleaning a semiconductor manufacturing system and method of manufacturing a semiconductor device
View Patent ↗A process of cleaning a semiconductor manufacturing system, and a method of manufacturing a semiconductor device. The cleaning process includes, for example, positioning a ceramic cover on the electrostatic chuck in tight contact with the chuck, and feeding a fluoride-based cleaning gas into a chamber. After the cleaning process, a process of forming a semiconductor film (deposition process) is performed. It is possible to prevent fluorine degasification from a substrate-supporting electrode (electrostatic chuck) during the deposition process. A semiconductor film can be formed without causing a temperature drop near the substrate. This prevents irregular film thickness, defective etching, film flaking, etc.
1. A process of cleaning a semiconductor manufacturing system having a reaction chamber and a substrate-supporting electrode provided inside the reaction chamber, with a substrate being placed on the substrate-supporting electrode when forming a semiconductor film on the substrate, the process comprising:
positioning an insulating cover on the substrate-supporting electrode;
supplying a fluoride-based cleaning gas into the reaction chamber, and supplying at least one of an inert gas and a fluorine-reducing gas into the reaction chamber from an approximate center of the substrate-supporting electrode through a gap between the insulating cover and the substrate-supporting electrode, a pressure in the gap being maintained to be higher than a pressure in the reaction chamber; and
generating a plasma in the reaction chamber.
2. The process of cleaning as set forth in claim 1 , wherein the fluoride-based cleaning gas is one of NF 3 , CF 4 , C 3 F 8 , C 2 F 6 , and ClF 3 .
3. The process of cleaning as set forth in claim 1 , wherein the fluorine-reducing gas is H 2 or NH 3 .
4. The process of cleaning as set forth in claim 1 , wherein the inert gas is He gas.