Thermal sensing and reset protection for an integrated circuit chip

1. A semiconductor package comprising:

a first semiconductor die mounted on a package substrate; and

a second semiconductor die mounted on said first semiconductor die and including a thermal sensing and reset protection circuit;

said thermal sensing and reset protection circuit being configured to determine a temperature of said first semiconductor die and to provide a reset protection signal to said first semiconductor die when said temperature is substantially equal to a preset temperature so as to protect said first semiconductor die from thermal runaway.

2. The semiconductor package of claim 1 , wherein said reset protection signal causes said first semiconductor die to be in, a sleep mode.

3. The semiconductor package of claim 1 , wherein said reset protection signal causes said first semiconductor die to be in a reset state.

4. The semiconductor package of claim 1 , wherein said thermal sensing and reset protection circuit comprises a bandgap circuit configured to output a reference voltage and a temperature dependent voltage, and wherein said temperature dependent voltage is proportional to said temperature of said first semiconductor die.

5. The semiconductor package of claim 4 , wherein said thermal sensing and reset protection circuit further comprises a comparator configured to receive said reference voltage and said temperature dependent voltage and to cause said thermal sensing and reset protection circuit to output said reset protection signal when said temperature dependent voltage is substantially equal to said reference voltage.

6. The semiconductor package of claim 4 , wherein said reference voltage is substantially independent of temperature variations.

7. The semiconductor package of claim 1 , wherein said reset protection signal controls power supplied to said first semiconductor die.

8. The semiconductor package of claim 1 , wherein said first semiconductor die is an SOC.

9. A semiconductor package comprising:

a semiconductor die mounted on a package substrate and including a thermal sensing and reset protection circuit;

said thermal sensing and reset protection circuit being configured to determine a temperature of said first semiconductor die and to provide a reset protection signal to said semiconductor die when said temperature is substantially equal to a preset temperature so as to protect said semiconductor die from thermal runaway.

10. The semiconductor package of claim 9 , wherein said reset protection signal causes said semiconductor die to be in a sleep mode.

11. The semiconductor package of claim 9 , wherein said reset protection signal causes said semiconductor die to be in a reset state.

12. The semiconductor package of claim 9 , wherein said thermal sensing and reset protection circuit comprises a bandgap circuit configured to output a reference voltage and a temperature dependent voltage, and wherein said temperature dependent voltage is proportional to said temperature of said semiconductor die.

13. The semiconductor package of claim 12 , wherein said thermal sensing and reset protection circuit further comprises a comparator configured to receive said reference voltage and said temperature dependent voltage and to cause said thermal sensing and reset protection circuit to output said reset protection signal when said temperature dependent voltage is substantially equal to said reference voltage.

14. The semiconductor package of claim 12 , wherein said reference voltage is substantially independent of temperature variations.

15. The semiconductor package of claim 9 , wherein said reset protection signal controls power supplied to said semiconductor die.

16. The semiconductor package of claim 9 , wherein said semiconductor die is an SOC.