MEMS capacitive device and method of forming same
View Patent ↗A MEMS capacitive device ( 90 ) includes a fixed capacitor plate ( 104 ) formed on a surface ( 102 ) of a substrate ( 100 ). A movable capacitor plate ( 114 ) is suspended above the fixed capacitor plate ( 104 ) by compliant members ( 116 ) anchored to the surface ( 102 ). A movable element ( 120 ) is positioned in spaced apart relationship from the movable capacitor plate ( 104 ) and has an actuator ( 130 ) formed thereon. Actuation of the actuator ( 130 ) causes abutment of a portion of the movable element ( 120 ) against a contact surface ( 136 ) of the movable plate ( 114 ). The abutment moves the movable plate ( 114 ) toward the fixed plate ( 104 ) to alter a capacitance ( 112 ) between the plates ( 104, 114 ). Another substrate ( 118 ) may be coupled to the substrate ( 100 ) such that a surface ( 126 ) of the substrate ( 118 ) faces the surface ( 102 ) of the substrate ( 100 ). The movable element ( 120 ) may be formed on the surface ( 126 ).
1. A capacitive device comprising:
a fixed capacitor plate formed on a surface of a substrate;
a movable capacitor plate positioned in spaced apart relationship above said fixed capacitor plate;
a compliant member interconnecting said movable capacitor plate with said surface, said compliant member enabling motion of said movable capacitor plate toward said fixed capacitor plate;
a movable element positioned in spaced apart relationship from said movable capacitor plate; and
a piezoelectric actuator formed on said movable element for moving said movable element into abutment with said movable capacitor plate in response to a force applied at said actuator, said abutment moving said movable capacitor plate toward said fixed capacitor plate to alter a capacitance between said movable and fixed capacitor plates.
2. A capacitive device as claimed in claim 1 wherein:
said movable capacitor plate is formed at a first structural layer; and
said piezoelectric actuator is formed at a second structural layer, said second structural layer differing from said first structural layer.
3. A capacitive device as claimed in claim 1 wherein said substrate is a first substrate, and said capacitive device further comprises a second substrate coupled with said first substrate, said second substrate having a second surface facing said first surface of said first substrate, and said movable element is formed on said second surface.
4. A capacitive device as claimed in claim 1 wherein said movable element is formed on said first surface of said substrate and is physically separate from said movable capacitor plate on said first surface.
5. A capacitive device as claimed in claim 1 wherein said movable element comprises:
a fixed end; and
a flexible section extending from said fixed end, said flexible section being positioned in spaced apart relationship above said movable capacitor plate.
6. A capacitive device comprising:
a fixed capacitor plate formed on a surface of a substrate;
a movable capacitor plate positioned in spaced apart relationship above said fixed capacitor plate;
a compliant member interconnecting said movable capacitor plate with said surface, said compliant member enabling motion of said movable capacitor plate toward said fixed capacitor plate;
a movable element positioned in spaced apart relationship from said movable capacitor plate;
a first actuator formed on said movable element for moving said movable element into abutment with said movable capacitor plate in response to a force applied at said actuator, said abutment moving said movable capacitor plate toward said fixed capacitor plate to alter a capacitance between said movable and fixed capacitor plates; and
a second actuator formed on said movable element, said first and second actuators being located approximately equidistant from and on opposing sides of said movable capacitor plate when said movable element abuts said movable capacitor plate.
7. A capacitive device comprising:
a fixed capacitor plate formed on a surface of a substrate;
a movable capacitor plate positioned in spaced apart relationship above said fixed capacitor plate;
a compliant member interconnecting said movable capacitor plate with said surface, said compliant member enabling motion of said movable capacitor plate toward said fixed capacitor plate;
a movable element positioned in spaced apart relationship from said movable capacitor plate;
a first actuator formed on said movable element for moving said movable element into abutment with said movable capacitor plate in response to a force applied at said first actuator, said abutment moving said movable capacitor plate toward said fixed capacitor plate to alter a capacitance between said movable and fixed capacitor plates; and
a second actuator formed on said first surface of said substrate, said second actuator facing said first actuator.
8. A capacitive device as claimed in claim 7 further comprising:
a third actuator formed on said movable element; and
a fourth actuator formed on said first surface, said fourth actuator facing said third actuator.
9. A capacitive device comprising:
a fixed capacitor plate formed on a surface of a substrate;
a movable capacitor plate positioned in spaced apart relationship above said fixed capacitor plate;
a compliant member interconnecting said movable capacitor plate with said surface, said compliant member enabling motion of said movable capacitor plate toward said fixed capacitor plate; and
a movable element positioned in spaced apart relationship from said movable capacitor plate, said movable element being actuated to cause abutment of said movable element against said movable capacitor plate, said abutment moving said movable capacitor plate toward said fixed capacitor plate to alter a capacitance between said movable and fixed capacitor plates, said movable element comprising:
a first fixed end;
a second fixed end; and
a flexible section coupled to and spanning between said first and second fixed ends, said flexible section being positioned in spaced apart relationship above said movable capacitor plate.
10. A method of fabricating a capacitive device comprising:
providing a substrate;
forming a material layer on a first surface of said substrate to include a fixed capacitor plate;
following said forming said material layer, forming a sacrificial layer on said first material layer;
forming a movable capacitor plate on said sacrificial layer and interconnected with said first surface via a compliant member;
removing said sacrificial layer following said forming said movable capacitor plate such that said movable capacitor plate is positioned in spaced apart relationship above said fixed capacitor plate and said compliant member enables motion of said movable capacitor plate toward said fixed capacitor plate; and
forming a movable element positioned in spaced apart relationship from said movable capacitor plate, and physically separate from said movable capacitor plate, said movable element adapted to be actuated to cause abutment of said movable element against said movable capacitor plate, said abutment moving said movable capacitor plate toward said fixed capacitor plate to alter a capacitance between said movable and fixed capacitor plates.
11. A method as claimed in claim 10 wherein said substrate is a first substrate, and said method further comprises:
providing a second substrate;
said forming said movable element forms said movable element on a second surface of said second substrate; and
coupling said second substrate with said first substrate to form a volume between said first and second substrates in which said fixed capacitor plate, said movable capacitor plate, said compliant member, and said movable element are positioned.
12. A method as claimed in claim 10 further comprising forming an actuator on said movable element, said actuator being configured to move said movable element in said abutment with said movable capacitor plate in response to a force applied at said actuator.
13. A method as claimed in claim 12 wherein:
said forming said movable capacitor plate forms said movable capacitor plate at a first structural layer; and
said forming said actuator forms said actuator at a second structural layer that differs from said first structural layer.
14. A method of fabricating a capacitive device comprising:
providing a first substrate;
forming a material layer on a first surface of said substrate to include a fixed capacitor plate;
forming a movable capacitor plate in spaced apart relationship above said fixed capacitor plate and interconnected with said first surface via a compliant member, said compliant member enabling motion of said movable capacitor plate toward said fixed capacitor plate;
providing a second substrate;
forming a movable element on a second surface of said second substrate, said forming said movable element including:
forming a sacrificial layer on said second surface of said second substrate;
forming first and second ends of said movable element extending through said sacrificial layer and coupled to said second surface;
forming a flexible section of said movable element on said sacrificial layer, said flexible section spanning between and connected with said first and second ends; and
removing said sacrificial layer to enable said flexible section to flex along its longitudinal dimension upon actuation; and
coupling said second substrate with said first substrate to form a volume between said first and second substrates in which said fixed capacitor plate, said movable capacitor plate, said compliant member, and said movable element are positioned, said movable element being positioned in spaced apart relationship from said movable capacitor plate, and physically separate from said movable capacitor plate, said movable element adapted to be actuated to cause abutment of said movable element against said movable capacitor plate, said abutment moving said movable capacitor plate toward said fixed capacitor plate to alter a capacitance between said movable and fixed capacitor plates.