Reduced-crosstalk wirebonding in an optical communication system
View Patent ↗Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.
1. A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
wherein each wirebond group comprises:
a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
a second wirebond crossing the first wirebond and coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip; and
a third wirebond coupling the opto-electronic device chip to the signal processing chip, wherein the third wirebond does not cross either of the first and second wirebonds.
2. The system claimed in claim 1 , wherein each opto-electronic device is an opto-electronic detector comprising a PIN diode.
3. The system claimed in claim 1 , wherein the third wirebond couples an N-terminal of the opto-electronic device to the signal processing chip.
4. The system claimed in claim 1 , wherein the third wirebond couples a fixed potential terminal of the opto-electronic device chip to the signal processing chip.
5. The system claimed in claim 1 , wherein each opto-electronic device is an opto-electronic detector comprising a PIN diode.
6. The system claimed in claim 1 , wherein each opto-electronic device is an opto-electronic detector, and the first wirebond couples an P-terminal of the opto-electronic detector to an amplifier of the signal processing chip.
7. The system claimed in claim 1 , wherein the second and third wirebonds couple an N-terminal of the opto-electronic device to a filtered power supply of the signal processing chip.
8. The system claimed in claim 1 , wherein:
each opto-electronic device is an opto-electronic detector;
the first wirebond couples an N-terminal of the opto-electronic detector to an amplifier of the signal processing chip; and
the second and third wirebonds couple a P-terminal of the opto-electronic detector to a fixed potential.
9. A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
wherein each wirebond group comprises:
a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond; and
a third wirebond coupling the opto-electronic device chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, the third wirebond coupling an N-terminal of the opto-electronic device to the signal processing chip.
10. A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
wherein each wirebond group comprises:
a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond; and
a third wirebond coupling the opto-electronic device chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, the third wirebond coupling a fixed potential terminal of the opto-electronic device chip to the signal processing chip.
11. A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
wherein each wirebond group comprises:
a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond; and
a third wirebond coupling the opto-electronic device chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, wherein the second and third wirebonds couple an N-terminal of the opto-electronic device to a filtered power supply of the signal processing chip.
12. A system for coupling an opto-electronic detector chip having a plurality of opto-electronic detectors to a signal processing chip, comprising:
a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic detectors, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
wherein each wirebond group comprises:
a first wirebond coupling a P-terminal of the opto-electronic detector of the wirebond group to the signal processing chip, the first wirebond coupling an N-terminal of the opto-electronic detector to an amplifier of the signal processing chip;
a second wirebond coupling an N-terminal of the opto-electronic detector of the wirebond group to the signal processing chip, the second wirebond substantially parallel to the first wirebond and disposed on a first side of the first wirebond; and
a third wirebond coupling the opto-electronic detector chip to the signal processing chip, the third wirebond substantially parallel to the first wirebond and disposed on a second side of the first wirebond opposite the first side, wherein the second and third wirebonds couple a P-terminal of the opto-electronic detector to a fixed potential.
13. A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
wherein each wirebond group comprises:
a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
a second wirebond crossing the first wirebond and coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip; and
a third wirebond crossing both the first wirebond and the second wirebond and coupling the opto-electronic device chip to the signal processing chip.
14. The system claimed in claim 13 , wherein each opto-electronic device is an opto-electronic detector comprising a PIN diode.
15. The system claimed in claim 13 , wherein each opto-electronic device is an opto-electronic detector, and the first wirebond couples the P-terminal of the opto-electronic detector to an amplifier of the signal processing chip.
16. The system claimed in claim 13 , wherein the second and third wirebonds couple the N-terminal of the opto-electronic device to a filtered power supply of the signal processing chip.
17. The system claimed in claim 13 , wherein:
each opto-electronic device is an opto-electronic detector;
the first wirebond couples an N-terminal of the opto-electronic detector to an amplifier of the signal processing chip; and
the second and third wirebonds couple a P-terminal of the opto-electronic detector to a fixed potential.