System for making contact between a transmit/receive module and a testing device

1. A system for making an electrical connection between a testing device and a transmit/receive module T/R for the transmission of high-frequency signals of an active antenna, said system comprising:

a mechanically guided contacting unit having a plurality of contact elements for contacting the T/R module;

a line substrate arranged on the contacting unit and electrically connected with it; and

a trough configured to receive the T/R module such that the position of the T/R module relative to the mechanically guided contacting unit is roughly determined; wherein,

the contacting unit has a frame-shaped configuration, such as to surround and engage with an outer periphery of the T/R module for making said contact;

said frame-shaped configuration is such that engagement of said contacting unit with said T/R module causes said contacting unit to be positioned relative to the T/R module so that contact with the T/R module is established by way of the contact elements; and

said line substrate comprises a shielded triplate line by which a high-frequency signal can be conducted to the testing device.

2. The system according to claim 1 , wherein:

an upper metalized plane and an upper substrate of said triplate line are removed at an end of the triplate line, providing a transition to a shielded coplanar line; and

a connector for connecting a coaxial line is mounted at said end of the triplate line.

3. The system according claim 2 , wherein the coplanar line is connected with a coaxial connector for connecting the testing device.

4. The system according to claim 3 , wherein throughplatings between the module-side metallization plane of the triplate line and the metallization plane away from the module, are provided on the triplate line along an outer contour of the coaxial connector.

5. The system according to claim 1 , wherein:

the contact elements of the contacting unit are constructed as spring contact pins; and

during the contacting, said spring contact pins come in contact with metallic contact surfaces on the line substrate and the T/R module.

6. The system according to claim 5 , wherein contact elements that establish a ground/signal/ground transition of the contacting unit are surrounded by further contact elements for shielding the high-frequency signal.

7. The system according to claim 1 , wherein the high-frequency signal is conducted via a throughplating, from a module-side metallization plane to a central metallization plane of the triplate line.

8. The system according to claim 7 , wherein the throughplating for the high-frequency signal is surrounded by throughplatings between the module-side metallization plane and the metallization plane away from the module, of the triplate line.

9. The system according to claim 1 , further comprising additional throughplatings between the module-side metallization plane and the metallization plane away from the module, on both sides along the inner conductor of the central metallization plane.

10. The system according to claim 8 , wherein the throughplatings are mutually connected between the module-side metallization plane and the metallization plane away from the module, in the central metallization plane by means of a metallization surface.

11. The system according to claim 1 , wherein:

the line substrate and additional contact pins inside the contacting unit are configured to accommodate transmission of direct-current signals and control signals between a conductor card arranged on the line substrate and the T/R module; and

signal guidance takes place within the module-side metallization plane of the triplate line.

12. The system according to claim 1 , further comprising a pressure plate which presses upon a housing of the T/R module, which pressure plate has a step-shaped construction on at least one of its edges.