Acidic post-CMP cleaning composition
View Patent ↗An acidic post-CMP cleaning composition includes at least one polyamino-polycarboxylic acid, or salt thereof; at least one hydroxycarboxylic acid, or salt thereof; and the remainder being substantially water. The acidic cleaning composition also includes a surfactant. The acidic post-CMP cleaning composition has a pH of 1 to 5, and is useful for removing the contaminants from the wafer surface after a CMP process without making roughness worse.
1. An acidic post-CMP cleaning composition consisting of:
at least one polyamino-polycarboxylic acid, or salt thereof;
at least one hydroxycarboxylic acid, or salt thereof;
at least one surfactant, wherein the surfactant is selected from the group consisting of alkylsulfonic acid, alkylbenzenesulfonic acid, alkylsulfonic acid, sulfosuccinate, 2-aminoethanesulfonic acid, nonoxynol-4 sulfate and lauryl-sulfonate;
one of tetramethylammonium hydroxide, ammonium hydroxide, tetrabutylammonium hydroxide, tetraethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethyldiethylammonium hydroxide, tetrapropylammonium hydroxide, and phosphazenes; and
water,
wherein the acidic cleaning composition has a pH of 1 to 5.
2. The composition according to claim 1 , wherein the polyamino-polycarboxylic acid is selected from the group consisting of monoamino-polycarboxylic acid, diamino-polycarboxylic acid, and triamino-polycarboxylic acid.
3. The composition according to claim 1 , wherein the polyamino-polycarboxylic acid is triamine pentaacetic acid.
4. The composition according to claim 3 , wherein the triamine pentaacetic acid is selected from the group consisting of ethylene triamine pentaacetic acid, diethylene triamine pentaacetic acid, and triethylene triamine pentaacetic acid.
5. The composition according to claim 1 , wherein the salt of the polyamino-polycarboxylic acid is selected from the group consisting of alkali metal, alkaline earth metal and ammonium salts.
6. The composition according to claim 1 , wherein the polyamino-polycarboxylic acid is present in an amount from 0.001 to 10% by weight based on the total weight of the acidic post-CMP cleaning composition.
7. The composition according to claim 1 , wherein the hydroxycarboxylic acid is selected from the group consisting of malic acid, tartaric acid, lactic acid, and citric acid.
8. The composition according to claim 1 , wherein the salt of the hydroxycarboxylic acid is selected from the group consisting of alkali metal, alkaline earth metal and ammonium salts.
9. The composition according to claim 1 , wherein the hydroxycarboxylic acid is present in an amount from 0.05 to 20% by weight based on the total weight of the acidic post-CMP cleaning composition.
10. The composition according to claim 1 , wherein the surfactant is present in an amount from 0.001 to 10% by weight based on the total weight of the acidic post-CMP cleaning composition.