Adhesive composition and structure comprising at least one layer of the said composition
View Patent ↗The invention relates to an adhesive composition comprising at least one polyamide A, with a mean number of carbon atoms per nitrogen atom (C/N), noted C A , of between 4 and 8.5; at least one polyamide B, with a melting point of greater than or equal to 180° C. and a mean number C/N, noted C B , of between 7 and 10; at least one polyamide C, with a mean number C/N, noted C C , of between 9 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of C/N of the polyamides A, B and C satisfying the following strict inequality: C A <C B <C C , and also to multilayer structures.
1. A structure comprising at least two layers, wherein one layer is an adhesive layer (I) having a composition comprising:
at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted CA, of between 4 and 8.5;
at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted CB, of between 7 and 10;
at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted CC, of between 9 and 18:
wherein at least 50% by weight of the composition is formed from polyamides A, B and C,
wherein said polyamides in the composition have a mass-weighted mean of heats of fusion of greater than 25 J/g (DSC), and wherein polyamide A comprises from 8% to 33% by weight of the total weight of polyamides present in the composition, polyamide B comprises from 34% to 84% by weight of the total weight of polyamides present in the composition, and polyamide C comprises from 8% to 33% by weight of the total weight of polyamides present in the composition and
wherein additionally the mean number of carbon atoms per nitrogen atom of each polyamides A, B and C also satisfying the following: CA<CB<CC.
2. The structure according to claim 1 , wherein (CB-CA) and/or (CC-CB) is between 1 and 4.
3. The structure according to claim 1 , wherein polyamide A has a melting point greater than or equal to 210° C. and polyamide C has a melting point that is less than 200° C.
4. The structure according to claim 1 , wherein polyamide A is chosen from PA6, PA4.6 and PA6.6, polyamide B is chosen from PA6.10 and PA6.12, and polyamide C is chosen from PA10.10, PA11, PA12, PA10.12 and PA6.18.
5. The structure according to claim 1 , wherein the polyamide noted A has a mean number of carbon atoms per nitrogen atom, noted CA, of between 4 and 7.
6. The structure according to claim 1 , wherein the polyamide noted B has a mean number of carbon atoms per nitrogen atom, noted CB, of between 7.5 and 9.5.
7. The structure according to claim 1 , wherein the polyamide noted C has a mean number of carbon atoms per nitrogen atom, noted CC, of between 10 and 18.
8. The structure according to claim 1 , wherein (CB-CA) and/or (CC-CB) is between 2 and 3.
9. The structure according to claim 1 , wherein the composition comprises from 50% to 76% by weight of polyamide B relative to the total weight of polyamides present in the composition.
10. The Structure according to claim 1 , wherein a second layer is a barrier layer (II), and wherein said barrier layer (II) is a composition comprising polymers that are barriers to biofuels.
11. The structure of claim 10 , wherein the second layer is a barrier layer (II), and wherein said barrier layer (II) is a composition comprising polymers chosen from EVOH and polyamide A, or a mixture thereof.
12. The structure according to claim 1 which comprises at least a third layer, and wherein said third layer is a tough layer (III) formed from a composition comprising polyamide C, the adhesive layer (I) being arranged between the said tough layer (III) and a barrier layer (II) and wherein each layer has a contact zone and wherein the layers adhere to each other via their respective contact zones.
13. The structure according to claim 12 wherein polyamide C is PA11, PA12, PA10.10, PA10.12 and PA12/10T or a mixture thereof.
14. The structure according to claim 1 , which comprises, in the following order:
a third layer, referred to as a tough layer (III), formed from a composition comprising polyamide C,
the adhesive layer (I),
a second layer, referred to as a barrier layer (II), formed from a composition comprising EVOH, and
a fourth layer (IV) formed from a composition comprising polyamide A,
wherein each layer has a contact zone and wherein the layers adhere to each other via their respective contact zones.
15. The structure according to claim 1 , which comprises the following five successive layers:
a tough layer (III) formed from a composition comprising polyamide C,
the adhesive layer (I),
a barrier layer (II) formed from a composition comprising EVOH,
another adhesive layer (I), and
a tough layer (III) formed from a composition comprising polyamide C,
wherein each layer has a contact zone and wherein the layers adhere to each other via their respective contact zones.
16. The structure according to claim 1 , which is a pipe, a container, a film or a plate.