IP Library Granted Patent US 7,848,095
Granted Patent B2
US 7,848,095 · App. 12/396,867 · Granted Dec 7, 2010

Structure of mounting electronic device into housing

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Quick Facts
Patent No.
US 7,848,095
App. No.
12/396,867
Granted
Dec 7, 2010
Kind
B2
Abstract

In a structure of mounting an electronic device into a housing according to the present invention, the electronic device has the following structure. First and second storage devices are connected to respective connecting parts provided on a substrate. Convex portions provided on a first supporting member are fitted from above into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate, respectively. Convex portions provided on a second supporting member are fitted from below into the gap between the first storage device and the substrate and the gap between the second storage device and the substrate, respectively. The electronic device into which the first and second supporting members are fitted is inserted into the housing from an opening thereof, and fixed within the housing by the housing and a cover.

Claims (62)

1. A structure of mounting an electronic device into a housing, comprising:

a first supporting member configured to support the electronic device;

a second supporting member configured to support the electronic device; and

a cover configured to cover an opening formed in the housing,

the electronic device including:

a substrate;

at least one connecting part provided on the substrate; and

a storage device to be connected to the connecting part, wherein

the first supporting member is mounted to the electronic device by fitting a convex portion from above into a gap between the storage device and the substrate, the convex portion being provided on the first supporting member,

the second supporting member is mounted to the electronic device by fitting a convex portion from below into a gap between the storage device and the substrate, the convex portion being provided on the second supporting member, and

the electronic device to which the first supporting member and the second supporting member are mounted is inserted from the opening into the housing, and fixed within the housing by the housing and the cover.

2. The structure according to claim 1 , wherein

the connecting part includes:

a first connecting part provided on a front surface of the substrate; and

a second connecting part provided on a back surface of the substrate,

the storage device includes:

a first storage device to be connected to the first connecting part; and

a second storage device to be connected to the second connecting part,

convex portions provided on the first supporting member are fitted from above into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate, and

convex portions provided on the second supporting member are fitted from below into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate.

3. The structure according to claim 1 , wherein

the connecting part includes:

a first connecting part provided on a front surface of the substrate; and

a second connecting part provided on a back surface of the substrate,

the storage device is connected to the first connecting part,

a space occupying body is connected to the second connecting part,

convex portions provided on the first supporting member are fitted from above into a gap between the storage device and the substrate and a gap between the space occupying body and the substrate, and

convex portions provided on the second supporting member are fitted from below into a gap between the storage device and the substrate and a gap between the space occupying body and the substrate.

4. The structure according to claim 1 , wherein

a protrusion provided on the first supporting member is fitted from above into a hole formed in the storage device, and

a protrusion provided on the second supporting member is fitted from below into a hole formed in the storage device.

5. The structure according to claim 4 , wherein

the connecting part includes:

a first connecting part provided on a front surface of the substrate; and

a second connecting part provided on a back surface of the substrate,

the storage device includes:

a first storage device to be connected to the first connecting part; and

a second storage device to be connected to the second connecting part,

protrusions provided on the first supporting member are fitted from above into holes formed in the first storage device and the second storage device, and

protrusions provided on the second supporting member are fitted from below into holes formed in the first storage device and the second storage device.

6. The structure according to claim 4 , wherein

the connecting part includes:

a first connecting part provided on a front surface of the substrate; and

a second connecting part provided on a back surface of the substrate,

the storage device is connected to the first connecting part,

a space occupying body is connected to the second connecting part,

protrusions provided on the first supporting member are fitted from above into holes formed in the storage device and the space occupying body, and

protrusions provided on the second supporting member are fitted from below into holes formed in the storage device and the space occupying body.

7. The structure according to claim 2 , wherein

in the electronic device, a first heat transferring body is inserted between the substrate and the first storage device,

in the electronic device, a second heat transferring body is inserted between the substrate and the second storage device, and

convex portions provided on the first supporting member and convex portions provided on the second supporting member are fitted into a gap between the first heat transferring body and the substrate and a gap between the second heat transferring body and the substrate.

8. The structure according to claim 3 , wherein

in the electronic device, a first heat transferring body is inserted between the substrate and the storage device,

in the electronic device, a second heat transferring body is inserted between the substrate and the space occupying body, and

convex portions provided on the first supporting member and convex portions provided on the second supporting member are fitted into a gap between the first heat transferring body and the substrate and a gap between the second heat transferring body and the substrate.

9. The structure according to claim 2 , wherein

in the electronic device, a first heat transferring body is inserted between the substrate and the first storage device, and

convex portions provided on the first supporting member and convex portions provided on the second supporting member are fitted into a gap between the first heat transferring body and the substrate and a gap between the second storage device and the substrate.

10. The structure according to claim 3 , wherein

in the electronic device, a first heat transferring body is inserted between the substrate and the storage device, and

convex portions provided on the first supporting member and convex portions provided on the second supporting member are fitted into a gap between the first heat transferring body and the substrate and a gap between the space occupying body and the substrate.

Assignments (3)
CHANGE OF NAME Recorded Sep 30, 2025
From: MELCO HOLDINGS INC.
To: BUFFALO INC.
Reel/Frame 072988/0847 →
MERGER Recorded Jul 23, 2025
From: BUFFALO INC.
To: MELCO HOLDINGS INC.
Reel/Frame 072191/0806 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2009
From: KOUYAMA, TOMOAKI; MATSUI, JUN
To: BUFFALO INC.
Reel/Frame 022548/0849 →