IP Library Granted Patent US 8,188,480
Granted Patent B2
US 8,188,480 · App. 12/397,358 · Granted May 29, 2012

Thin film field effect transistor and display

Assignee: FUJIFILM Corporation
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Quick Facts
Patent No.
US 8,188,480
App. No.
12/397,358
Granted
May 29, 2012
Kind
B2
Abstract

A TFT is provided which includes, on a substrate, at least a gate electrode, a gate insulating layer, an active layer containing an amorphous oxide semiconductor, a source electrode and a drain electrode, wherein a resistance layer containing an amorphous oxide and having a thickness of more than 3 nm is disposed between the active layer and at least one of the source electrode or the drain electrode, and a band gap of the active layer is smaller than a band gap of the resistance layer. Also, a display using the TFT is provided.

Claims (21)

1. A thin film field effect transistor comprising, on a substrate, at least a gate electrode, a gate insulating layer, an active layer containing an amorphous oxide semiconductor, a source electrode and a drain electrode, wherein

a resistance layer containing an amorphous oxide and having a thickness of more than 3 nm is disposed to cover an entire surface of the active layer at a side at which the source electrode and the drain electrode are provided, and is disposed between the active layer and at least one of the source electrode or the drain electrode,

a band gap of the active layer is smaller than a band gap of the resistance layer,

the active layer does not directly contact the drain electrode and the source electrode, and

the band gap of the active layer is 2.0 eV or more and less than 4.0 eV, and

wherein the resistance layer further covers the entire side surfaces of the active layer.

2. The thin film field effect transistor according to claim 1 , wherein the band gap of the resistance layer is 4.0 eV or more and less than 15.0 eV.

3. The thin film field effect transistor according to claim 1 , wherein a difference between the band gap of the active layer and the band gap of the resistance layer is 0.1 eV or more and less than 13.0 eV.

4. The thin film field effect transistor according to claim 1 , wherein a carrier concentration of the active layer is higher than a carrier concentration of the resistance layer.

5. The thin film field effect transistor according to claim 1 , wherein a film thickness of the resistance layer is from 5 nm to 80 nm.

6. The thin film field effect transistor according to claim 1 , wherein the amorphous oxide semiconductor in the active layer includes at least one element selected from the group consisting of In, Sn, Zn, and Cd.

7. The thin film field effect transistor according to claim 1 , wherein the amorphous oxide in the resistance layer includes at least one element selected from the group consisting of Ga, Mg, Al, Ca, and Si.

8. The thin film field effect transistor according to claim 1 , wherein two layers comprising the active layer and the resistance layer are disposed between the gate insulating layer, and the source electrode or the drain electrode.

9. The thin film field effect transistor according to claim 1 , wherein the active layer and the resistance layer are layers each formed by a sputtering method.

10. The thin film field effect transistor according to claim 1 , wherein the substrate is a flexible substrate.

11. A display including a light-emitting element having a pair of electrodes and a light emission layer interposed between the electrodes, and a field effect transistor for driving the light-emitting element, wherein the field effect transistor is the thin film field effect transistor according to claim 1 .

12. The thin film field effect transistor according to claim 7 , wherein the amorphous oxide in the resistance layer includes at least Ga 2 O 3 .

13. The thin film field effect transistor according to claim 12 , wherein the amorphous oxide semiconductor in the active layer includes at least In.

14. The thin film field effect transistor according to claim 13 , wherein the amorphous oxide in the active layer is selected from the group consisting of IGZO and ITO.

15. The thin film field effect transistor according to claim 1 , wherein the thin film filed effect transistor is a stagger structure.

16. The thin film field effect transistor according to claim 1 , wherein the thin film filed effect transistor is a reversed stagger structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2022
From: FUJIFILM CORPORATION
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 061486/0083 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2009
From: ITAI, YUICHIRO
To: FUJIFILM CORPORATION
Reel/Frame 022381/0794 →
Priority Claims (1)
JP 2008-076493 · Mar 24, 2008 · national
Continuity (1)
Related Publication 20090236596A1 · Sep 24, 2009