Compact camera module
The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.
1. A compact camera module, comprising:
an image sensor array chip comprising an image sensor array on a top surface thereof;
a package layer underlying side surfaces and a bottom surface of the image sensor array chip;
a trace set comprising a plurality of first traces and at least one second trace, wherein the at least one second trace comprises a vertical portion extending from a top surface via a through hole to a bottom surface of the image sensor array chip and a horizontal portion extending to an outer surface of the image sensor array chip, and one end of the at least one second trace is connected to a solder ball;
a transparent substrate covering the top surface of the image sensor array chip;
a spacer between the transparent substrate and the image sensor array chip, wherein the horizontal portion is disposed between the spacer and the image sensor array chip;
a set of optical elements overlying the transparent substrate, aligning with the image sensor array, and comprising a lens set; and
a zooming device connecting to the set of optical elements for adjusting a distance between the lens set and the image sensor array, wherein
the zooming device directly electrically joins with the at least one second trace.
2. The module as claimed in claim 1 , wherein the zooming device directly electrically joins the image sensing device at a position between the package layer and the transparent substrate.
3. The module as claimed in claim 1 , wherein the zooming device directly electrically joins the image sensing device at a position between side surfaces of the package layer and the transparent substrate.
4. The module as claimed in claim 3 , wherein the plurality of first traces are respectively sealed by insulating material at a position between side surfaces of the package layer and the transparent substrate.
5. The module as claimed in claim 1 , wherein the at least one second trace is directly electrically joined to the zooming device by solder, a retaining clamp, a thimble, or an anisotropic conduction paste.
6. The module as claimed in claim 1 , wherein the zooming device is selected from a group consisting of a piezo motor, a stepping motor, and a voice coil motor.