PRINTING MOLD AND MANUFACTURING METHOD THEREOF, AND METHOD OF FORMING THIN FILM PATTERN USING THE SAME

1 . A printing mold comprising:

a polymer-based main body comprising convex surface portions and concave surface portions; and

an ink-phobic layer disposed on the concave surface portions of the main body.

2 . The printing mold of claim 1 , wherein the ink-phobic layer comprises a hydrophobic surface.

3 . The printing mold of claim 2 , wherein the ink-phobic layer comprises at least one of n-octadecyltrimethoxysilane (ODS), octadecyltrichlorosilane (OTS), and heptadecafluoro-1,1,2,2-tetrahydrodecyl-1-trimethoxysilane (FAS).

4 . A printing mold comprising:

a substrate;

an ink-phobic layer disposed on a surface of the substrate; and

an ink-philic layer disposed on a portion of the ink-phobic layer.

5 . The printing mold of claim 4 , wherein the ink-phobic layer comprises at least one of n-octadecyltrimethoxysilane (ODS), octadecyltrichlorosilane (OTS), and heptadecafluoro-1,1,2,2-tetrahydrodecyl-1-trimethoxysilane (FAS).

6 . The printing mold of claim 4 , wherein the ink-philic layer comprises at least one of silicon, silicon oxide, silicon nitride, a metal, a metal oxide, and a metal nitride.

7 . A printing mold, comprising:

a polymer-based main body comprising convex surface portions and concave surface portions;

an ink-phobic layer disposed on the concave surface portions of the main body; and

an ink-philic layer disposed on the convex surface portions of the main body.

8 . A method of forming a thin film pattern using a printing mold, the method comprising:

coating a substrate-coating layer comprising a hydrophobic polymer film on a first substrate;

forming an ink layer comprising a first portion and a second portion on the substrate-coating layer;

arranging a mold over the ink layer, the mold comprising a convex portion, a concave portion, and an ink-phobic layer disposed on a surface of the concave portion;

contacting the convex portion of the mold with the first portion of the ink layer;

separating the mold and the ink layer from each other, thereby transferring the first portion of the ink layer onto the convex portion of the mold; and

re-transferring the transferred first portion of the ink layer onto a second substrate.

9 . The method of claim 8 , wherein the ink-phobic layer comprises a hydrophobic surface.

10 . The method of claim 9 , wherein the ink-phobic layer comprises at least one of n-octadecyltrimethoxysilane (ODS), octadecyltrichlorosilane (OTS), and heptadecafluoro-1,1,2,2-tetrahydrodecyl-1-trimethoxysilane (FAS).

11 . The method of claim 10 , wherein the ink layer comprises at least one of a metallic ink containing Ag or Cu, an IGZO solution, a semiconductor material containing pentacene, a Si solution, an ITO slurry, and a carbon nanotube dispersion.

12 . The method of claim 11 , wherein the hydrophobic polymer film comprises at least one of polydimethylsiloxane (PDMS) and a fluorine-containing film.

13 . The method of claim 12 , wherein the fluorine-containing film comprises a Teflon® film.

14 . The method of claim 13 , wherein a surface energy of the substrate-coating layer, a surface energy of the ink layer, and a surface energy of the convex portion of the mold increase in that order.

15 . The method of claim 14 , further comprising forming a first adhesive layer on the second substrate.

16 . The method of claim 15 , further comprising forming a second adhesive layer on a surface of the first portion before the re-transferring.