Anode for sputter coating
View Patent ↗A sputtering anode is disclosed wherein the anode is in the form of a container or vessel; and, wherein the conducting surface communicating with a cathode is the inside surface of the container or vessel. The anode can be mounted outside of a coating chamber having its opening communicating with the chamber or alternatively may be mounted within the chamber. The anode may be an inlet port for receiving inert gas for use in forming the plasma and for pressurizing the anode.
1. A sputtering apparatus for use in the sputtering of a material, comprising:
a cathode electrically coupled to a voltage source;
at least one anode defining a substantially closed vessel comprising one or more sidewalls and a bottom wall, said vessel having an opening to an electrically conductive inner body and having an outer body, wherein the inner and outer body are at a same electrical potential and are formed of the one or more sidewalls and bottom wall, such that the inner body is the inside one or more sidewalls and bottom wall of the vessel and an outside one or more sidewall forms the outer one or more sidewalls and outer bottom wall of the vessel, wherein the electrically conductive inner body is coupled to the voltage source for providing a voltage difference between the sputtering material and the conductive inner body, wherein the inner body of the vessel is for receiving and collecting electrons or negatively charged particles passing through the opening, wherein the opening to the electrically conducting inner body is so located for communicating with a coating chamber and wherein the anode is electrically isolated from the coating chamber, wherein the opening of the vessel is polygonal shaped, wherein the cathode is negatively biased and wherein the anode is positively biased, the cathode and the anode forming a part of a same electrical circuit;
wherein the opening is at one end or side face thereof, for communicating with a coating chamber and for allowing charged particles to flow between the electrically conductive inner body and the cathode external to the anode and within the coating chamber, and wherein the opening is at least two inches from a cathode within the coating chamber to facilitate a uniform pressure distribution over a target area, wherein the cathode is not within or encircled by the anode; and
wherein the opening has a diameter or largest opening length of “a” and wherein the opening is a distance “d” from the cathode, and wherein an angle α=arctan (a/d) and wherein α<90 degrees.
2. A sputtering apparatus anode as defined in claim 1 wherein the conductive inner body of the anode is at a higher potential than the inner walls of the coating chamber so that a majority of electrons will preferably flow to the inside of the anode rather than to the inner walls of the coating chamber.
3. A sputtering apparatus anode as defined in claim 2 , wherein the vessel has an inlet port for receiving an inert gas for igniting plasma in the presence of a sufficient voltage applied between the electrically conductive inner body and the cathode, and wherein the positive potential is at least 5V above ground.
4. A sputtering apparatus anode as defined in claim 1 adapted to be disposed outside of the coating chamber and physically coupled thereto such that the opening of the vessel is facing and open to the coating chamber.
5. A sputtering apparatus anode as defined in claim 1 wherein the outer body of the vessel is covered with a first material that is different than the inner body of the vessel.
6. A sputtering apparatus anode as defined in claim 5 , wherein the first material is an insulating material.
7. A sputtering apparatus anode as defined in claim 1 wherein the anode inner body is coupled to a switch for selectably floating, biasing or grounding the inner body.
8. A sputtering apparatus anode as defined in claim 1 wherein the opening is substantially smaller than a circumference of the vessel so that charged particles can flow between the inner body of the vessel and a cathode and such that coating material is substantially impeded from being deposited into the vessel.
9. A sputtering apparatus anode as defined in claim 1 fixedly coupled to an outside of a coating chamber such that in operation during coating, the anode serves as a conducting container and wherein charged particles flow between the cathode in the coating chamber and the inside of the vessel for coating a substrate disposed in the coating chamber with the material.
10. A sputtering apparatus anode as defined in claim 1 wherein the opening has an area of >10 cm2.
11. A sputtering apparatus anode as defined in claim 10 , wherein the opening is substantially circular and greater than 15 cm2.
12. A sputtering apparatus anode as defined in claim 1 , wherein the inner body is comprised of copper.
13. A sputtering apparatus anode as defined in claim 1 , wherein the inner body is comprised of stainless steel.
14. A sputtering apparatus anode as defined in claim 1 wherein an inside of the vessel is substantially cylindrical or spherical in cross section.
15. A sputtering apparatus anode as defined in claim 1 , wherein a surface area of the conductive inner body is at least 300 cm2.
16. A sputtering apparatus anode as defined in claim 3 , wherein the pressure in the anode cavity is at least 20% above the pressure in the coating chamber.
17. A sputtering apparatus anode as defined in claim 3 , wherein the pressure in the anode cavity is at least two times above the pressure in the coating chamber.
18. A sputtering apparatus anode as defined in claim 1 wherein the opening has an area of 15 cm2 to 30 cm2.
19. A sputtering apparatus anode as defined in claim 1 , wherein a surface area of the conductive inner body is at least 1200 cm2.