Method of manufacturing semiconductor device and semiconductor device

1. A method of manufacturing a semiconductor device comprising:

forming a capacitor having electrodes and a ferroelectric film provided therebetween above a substrate;

forming a pad electrode electrically connected to one of the electrodes of the capacitor above the substrate;

forming a protective film covering the pad electrode over the substrate;

forming an opening in the protective film exposing at least a part of the pad electrode;

bringing a measurement terminal into contact with the exposed surface of the pad electrode;

etching the surface of the pad electrode after the measurement terminal is brought into contact therewith; and

forming a hydrogen absorbing film on the protective film and the pad electrode exposed through the opening.

2. The method according to claim 1 , wherein the pad electrode is formed by sequentially laminating a first conductive film including a TiN film, a conductive pad being formed so as to have a recess at the opening and a flat region, and a second conductive film including a TiN film and provided on the flat region.

3. The method according to claim 1 , wherein the pad electrode is formed by sequentially laminating a first conductive film including a TiN film, a first conductive pad, a second conductive film including a TiN film, a second conductive pad, a third conductive film including a TiN film, and the pad electrode being formed so as to have a recess at the opening through which the second conductive pad and the second conductive film are exposed.

4. The method according to claim 1 , wherein the forming hydrogen absorbing films further includes forming Ti film or TiN film, and forming Pd film on the Ti film or the TiN film.

5. The method according to claim 1 , wherein the ferroelectric film includes lead titanate zirconate.

6. The method according to claim 1 , further comprising forming a connecting bonding wire or a stud bump over the hydrogen absorbing film.