Printed circuit board and electronic device
View Patent ↗According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.
1. A printed circuit board comprising:
a plurality of electrode pads on a quadrangular component mounting face on which a semiconductor component is to be mounted;
a plurality of hole terminals on the component mounting face so as to correspond to the electrode pads; and
a plurality of wiring patterns connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring patterns wired in directions across directions proceeding from a center of the component mounting face toward corners of the component mounting face, in respective areas into which the component mounting face is sectioned by borderlines connecting a central portion of the component mounting face and middle portions of sidelines of the component mounting face,
wherein an insulation film is on the component mounting face except for areas of the plurality of electrode pads and areas around the plurality of electrode pads, and
wherein each of the plurality of wiring patterns has a boundary of the insulation film and an exposed portion exposed from the insulation film, the exposed portion being equal to or greater than a half of a diameter of one of the plurality of electrode pads.
2. The printed circuit board of claim 1 , wherein the plurality of wiring patterns are wired in directions across directions of elastic deformation caused by thermal expansion extending around a mounted position of a semiconductor chip included in the semiconductor component on the component mounting face.
3. The printed circuit board of claim 1 , wherein the plurality of wiring patterns are arranged with predetermined distances in line-column directions.
4. An electronic device comprising:
a circuit board on which a semiconductor package is mounted; and
a body containing the circuit board, the circuit board comprising:
a plurality of electrode pads on a quadrangular component mounting face of the semiconductor package,
a plurality of hole terminals on the component mounting face so as to correspond to the plurality of electrode pads, and
a plurality of wiring patterns connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring patterns wired in directions across directions proceeding from a center of the component mounting face toward corners of the component mounting face, in respective areas into which the component mounting face is sectioned by borderlines connecting a central portion of the component mounting face and middle portions of sidelines of the component mounting face,
wherein an insulation film is on the component mounting face except for areas of the plurality of electrode pads and areas around the plurality of electrode pads, and
wherein each of the plurality of wiring patterns has a boundary of the insulation film and an exposed portion exposed from the insulation film, the exposed portion being equal to or greater than a half of a diameter of one of the plurality of electrode pads.
5. A printed circuit board comprising:
a plurality of electrode pads on a quadrangular component mounting face on which a semiconductor component is to be mounted;
a plurality of hole terminals on the component mounting face so as to correspond to the electrode pads; and
a plurality of wiring patterns connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring patterns wired in directions perpendicular to directions proceeding from a center of the component mounting face toward corners of the component mounting face, in respective areas into which the component mounting face is sectioned by borderlines connecting a central portion of the component mounting face and middle portions of sidelines of the component mounting face,
wherein an insulation film is on the component mounting face except for areas of the plurality of electrode pads and areas around the plurality of electrode pads, and
wherein each of the plurality of wiring patterns has a boundary of the insulation film and an exposed portion exposed from the insulation film, the exposed portion being equal to or greater than a half of a diameter of one of the plurality of electrode pads.
6. The printed circuit board of claim 5 , wherein the plurality of wiring patterns are wired in directions across directions of elastic deformation caused by thermal expansion extending around a mounted position of a semiconductor chip included in the semiconductor component on the component mounting face.
7. The printed circuit board of claim 5 , wherein the plurality of wiring patterns are arranged with predetermined distances in line-column directions.