Semiconductor device
View Patent ↗A semiconductor device including a MOSFET has a plurality of transistor cell regions disposed on a semiconductor substrate and a Schottky cell region disposed between the plurality of transistor cell regions. Each transistor cell region has a plurality of first trenches disposed in a main surface of the semiconductor substrate, a well region between the plurality of first trenches, a first gate insulating film and a first gate electrode of the MOSFET in each first trench, and a source region of the MOSFET in each well region. The Schottky cell region has a plurality of second trenches disposed in the main surface of the semiconductor substrate, a second gate insulating film and a second gate electrode of the MOSFET in each second trench, gate lead-out wiring connected to each second gate electrode, and a plurality of guard ring regions enclosing the respective second trenches.
1. A semiconductor device including a MOSFET, comprising:
a semiconductor substrate of an n-type, the semiconductor substrate having a main surface and a back surface opposite to the main surface;
a plurality of transistor cell regions disposed on the semiconductor substrate,
each of the plurality of transistor cell regions including:
a plurality of first trenches disposed in the main surface of the semiconductor substrate,
a well region of a p-type, in which a channel of the MOSFET is formed, disposed between the plurality of first trenches,
a first gate insulating film of the MOSFET disposed in each of the plurality of first trenches,
a first gate electrode of the MOSFET disposed on the first gate insulating film in each of the plurality of first trenches, and
a source region of the MOSFET disposed in each well region, the source region being an n-type;
a Schottky cell region disposed between the plurality of transistor cell regions in the semiconductor substrate,
the Schottky cell region including:
a plurality of second trenches disposed in the main surface of the semiconductor substrate,
a second gate insulating film of the MOSFET disposed in each of the plurality of second trenches,
a second gate electrode of the MOSFET disposed in each of the plurality of second trenches,
gate lead-out wiring disposed over the main surface of the semiconductor substrate and connected to each second gate electrode, and
a plurality of guard ring regions, which are p-type semiconductor regions, disposed in the main surface of the semiconductor substrate so as to enclose the respective second trenches;
a source electrode of the MOSFET disposed over the main surface of the semiconductor substrate,
the source electrode being electrically connected to the source region in each of the plurality of transistor cell regions,
the source electrode being in contact with the main surface of the semiconductor substrate so as to form a Schottky junction in the Schottky cell region;
and
a drain electrode of the MOSFET disposed over the back surface of the semiconductor substrate and electrically connected to the semiconductor substrate.
2. A semiconductor device according to claim 1 , wherein the guard ring regions are of deeper depth than each well region.
3. A semiconductor device according to claim 1 , wherein
a plurality of field insulating film portions are disposed on the main surface of the semiconductor substrate in the Schottky cell region,
the gate lead-out wiring and the source electrode are partially located over the plurality of field insulating film portions, and
the Schottky junction is formed between the plurality of field insulating film portions.
4. A semiconductor device according to claim 1 , wherein the Schottky junction is formed where no guard ring region is disposed.
5. A semiconductor device according to claim 1 , wherein the first gate electrodes and the second gate electrodes are connected.
6. A semiconductor device according to claim 1 , wherein the source electrode is comprised of aluminum.