IP Library Granted Patent US 8,207,558
Granted Patent B2
US 8,207,558 · App. 12/405,945 · Granted Jun 26, 2012

Semiconductor device, DC/DC converter and power supply

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 8,207,558
App. No.
12/405,945
Granted
Jun 26, 2012
Kind
B2
Abstract

A semiconductor device in which the self-turn-on phenomenon is prevented that can significantly improve power conversion efficiency. The semiconductor device is a system-in-package for power supply applications in which a high-side switch, a low-side switch, and two drivers are included in a single package. The device includes an auxiliary switch disposed between the gate and source of said low-side switch, and a low-side MOSFET 3 for the low-side switch and an auxiliary MOSFET 4 for the auxiliary switch are disposed on the same chip. In this way, the self-turn-on phenomenon can be prevented, allowing the mounting of a low-side MOSFET 3 with a low threshold voltage and thereby significantly improving power conversion efficiency. The gate of the auxiliary MOSFET 4 is driven by the driver for the high-side MOSFET 2 , thereby eliminating the need for a new drive circuit and realizing the same pin configuration as existing products, which facilitates easy replacement.

Claims (31)

1. A semiconductor device comprising:

a high-side switch;

a low-side switch;

drivers for driving said high-side switch and said low-side switch individually; and

an auxiliary switch that prevents self turn-on of said low-side switch and that is disposed between the gate and source of said low-side switch, wherein said high-side switch, said low-side switch, said drivers, and said auxiliary switch are included in a single package, said low-side switch and said auxiliary switch are disposed on the same chip, said low-side switch is comprised of a vertical MOSFET, said auxiliary switch is comprised of a lateral MOSFET, and a gate-source breakdown voltage of said MOSFET of said auxiliary switch is higher than a gate-source breakdown voltage of said MOSFET of said low-side switch.

2. The semiconductor device of claim 1 , wherein said lateral MOSFET further comprises:

a first auxiliary MOSFET, and

a second auxiliary MOSFET.

3. The semiconductor device of claim 2 , further comprising:

a PWM controller for feeding a PWM signal to said driver for driving said high-side switch and to said driver for driving said low-side switch; and

an inductor and a capacitor for smoothing voltages outputted from said high-side switch and said low-side switch.

4. The semiconductor device of claim 1 , wherein said auxiliary switch is driven by the output of said driver for driving said high-side switch.

5. The semiconductor device of claim 1 , wherein the gate-source breakdown voltage of said MOSFET for said low-side switch is 1 V or smaller.

6. A DC/DC converter for a semiconductor device comprising:

a high-side switch;

a low-side switch;

a first driver for driving said high-side switch and a second driver for driving said low-side switch; and

an auxiliary switch that prevents self turn-on of said low-side switch and that is disposed between the gate and source of said low-side switch, wherein said high-side switch, said low-side switch, said first driver, said second driver, and said auxiliary switch are included in a single package, said low-side switch and said auxiliary switch are disposed on the same chip, said low-side switch is comprised of a vertical MOSFET, and said auxiliary switch is comprised of a lateral MOSFET, and a gate-source breakdown voltage of said MOSFET of said auxiliary switch is higher than a gate-source breakdown voltage of said MOSFET of said low-side switch.

7. The DC/DC converter of claim 6 , wherein said lateral MOSFET further comprises:

a first auxiliary MOSFET, and

a second auxiliary MOSFET.

8. The DC/DC converter of claim 6 , wherein said auxiliary switch is driven by the output of said driver for driving said high-side switch.

9. The DC/DC converter of claim 6 , wherein the gate-source breakdown voltage of said MOSFET for said low-side switch is 1 V or smaller.

10. The DC/DC converter of claim 6 , further comprising:

a PWM controller for feeding a PWM signal to said first driver for driving said high-side switch and to said second driver for driving said low-side switch; and

an inductor and a capacitor for smoothing voltages outputted from said high-side switch and said low-side switch.

11. A power supply system for a semiconductor device comprising:

a high-side switch;

a low-side switch;

drivers for driving said high-side switch and said low-side switch individually; and

an auxiliary switch that prevents self turn-on of said low-side switch and that is disposed between the gate and source of said low-side switch, wherein said high-side switch, said low-side switch, said drivers, and said auxiliary switch are included in a single package, said low-side switch and said auxiliary switch are disposed on the same chip, said low-side switch is comprised of a vertical MOSFET, said auxiliary switch is comprised of a lateral MOSFET, and a gate-source breakdown voltage of said MOSFET of said auxiliary switch is higher than a gate-source breakdown voltage of said MOSFET of said low-side switch.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
MERGER Recorded Aug 27, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024892/0745 →
CHANGE OF NAME Recorded Aug 27, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024900/0001 →
Priority Claims (1)
JP 2004-203094 · Jul 9, 2004 · national
Continuity (2)
Continuation 11175288 · Jul 7, 2005
Related Publication 20090179235A1 · Jul 16, 2009