Semiconductor device and method of manufacturing the same
According to the present invention, a protective seal S 1 for protecting a transparent member 11 is composed of an organic base 16 , adhesive layers 17 , and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16 , to sides 11 b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16 , to a surface 11 a of the transparent member. The organic base 16 is fixed to the sides 11 b and the surface 11 a of the transparent member 11 with the adhesive layers 17 and 18.
1. A semiconductor device, comprising:
a semiconductor element having an optical element region;
a transparent member having an upper surface, a lower surface and a side surface; and
a protective seal adjacent to the upper surface and the side surface of the transparent member,
wherein the transparent member is on the semiconductor element,
a region of the protective seal directly above the semiconductor element is directly connected to the upper surface of the transparent member, and
the protective seal is connected to the side surface of the transparent member via a first adhesive.
2. The semiconductor device according to claim 1 ,
wherein a hollow is between the semiconductor element and the transparent member.
3. A semiconductor device, comprising:
a semiconductor element having an optical element region;
a substrate having a cavity, the cavity storing the semiconductor element;
a transparent member having an upper surface, a lower surface and a side surface, the lower surface of the transparent member bonded to the substrate; and
a protective seal adjacent to the upper surface and the side surface of the transparent member,
wherein a region of the protective seal directly above the semiconductor element is directly connected to the upper surface of the transparent member, and
the protective seal is connected to the side surface of the transparent member via a first adhesive.
4. The semiconductor device according to claim 3 ,
wherein the protective seal comprises a base.
5. A semiconductor device, comprising:
a semiconductor element having an optical element region;
a transparent member having an upper surface, a lower surface and a side surface, the lower surface of the transparent member connected to an upper surface of the semiconductor element to cover the optical element region;
a substrate on which the semiconductor element is mounted;
a mold resin connected to a side surface of the semiconductor element; and
a protective seal adjacent to the upper surface of the transparent member and an upper surface of the mold resin,
wherein a region of the protective seal directly above the semiconductor element is directly connected to the upper surface of the transparent member, and
the protective seal is connected to the upper surface of the mold resin via a first adhesive.
6. The semiconductor device according to claim 5 ,
wherein the protective seal comprises a base.
7. The semiconductor device according to claim 3 ,
wherein in the protective seal, a region covering the upper surface of the transparent member is transparent.
8. The semiconductor device according to claim 4 ,
wherein in the protective seal, a region covering the upper surface of the transparent member is transparent.
9. The semiconductor device according to claim 5 ,
wherein in the protective seal, a region covering the upper surface of the transparent member is transparent.
10. The semiconductor device according to claim 6 ,
wherein in the protective seal, a region covering the upper surface of the transparent member transparent.
11. The semiconductor device according to claim 1 ,
wherein the protective seal is connected to the upper surface of the transparent member via a second adhesive which has lower adhesion than the first adhesive.
12. The semiconductor device according to claim 3 ,
wherein the protective seal is connected to the upper surface of the transparent member via a second adhesive, and
an adhesion of the second adhesive is lower than an adhesion of the first adhesive.
13. The semiconductor device according to claim 5 ,
wherein the protective seal is connected to the upper surface of the transparent member via a second adhesive, and
an adhesion of the second adhesive is lower than an adhesion of the first adhesive.
14. The semiconductor device according to claim 1 ,
wherein the optical element region includes at least one of a light receiving region and a light transmitting region.
15. The semiconductor device according to claim 3 ,
wherein the optical element region includes at least one of a light receiving region and a light transmitting region.
16. The semiconductor device according to claim 5 ,
wherein the optical element region includes at least one of a light receiving region and a light transmitting region.
17. The semiconductor device according to claim 1 ,
wherein the protective seal is connected to the entire upper surface of the transparent member.
18. The semiconductor device according to claim 3 ,
wherein the protective seal is connected to the entire upper surface of the transparent member.
19. The semiconductor device according to claim 5 ,
wherein the protective seal is connected to the entire upper surface of the transparent member.