PROCESSING CHAMBER
A process apparatus for treatment of a substrate comprising a load chamber for loading the substrate, a process chamber for processing the substrate, a sealing plane separating the process chamber from the load chamber and means for vertically moving the substrate from the load chamber to the process chamber, and a method for treating the substrate are provided. The load chamber is located in one of the lower and upper portions of the process apparatus, and the process chamber is located in the other of the lower and upper portions of the process apparatus. The process apparatus and method of the present invention will provide easy maintenance and reduced costs by reducing the number of movements for loading the substrate.
1 . A process apparatus for treatment of a substrate comprising:
a load chamber for loading said substrate;
a process chamber for processing said substrate;
a sealing plane separating said process chamber from said load chamber; and
means for vertically moving said substrate from said load chamber to said process chamber,
wherein said load chamber is located in one of the lower and upper portions of said process apparatus, and said process chamber is located in the other of the lower and upper portions of said process apparatus.
2 . The apparatus of claim 1 , wherein said load chamber is located in the lower portion of said process apparatus, and said process chamber is located in the upper portion of said process apparatus.
3 . The apparatus of claim 1 , wherein said load chamber is located in the upper portion of said process apparatus, and said process chamber is located in the lower portion of said process apparatus.
4 . The apparatus of claim 1 , further comprising first and second openings for loading and unloading said substrate, wherein said first opening is opposed to said second opening.
5 . The apparatus of claim 1 , wherein said process apparatus is cylindrical and has symmetric interfaces.
6 . The apparatus of claim 1 , wherein said process chamber performs PVD processing to said substrate.
7 . A method for treating a substrate in a process apparatus having a load chamber for loading said substrate, a process chamber for processing said substrate, a sealing plane separating said process chamber from said load chamber, and means for vertically moving said substrate from said load chamber to said process chamber, wherein said load chamber is located in one of the lower and upper portions of said process apparatus, and said process chamber is located in the other of the lower and upper portions of said process apparatus, said method comprising the steps of:
loading said substrate to said load chamber;
moving vertically said substrate from said load chamber to said process chamber by the vertically moving means through said sealing plane;
treating said substrate in said process chamber; and
unloading said substrate from said process chamber.
8 . The method of claim 7 , wherein said load chamber is located in the lower portion of said process apparatus, and said process chamber is located in the upper portion of said process apparatus.
9 . The method of claim 7 , wherein said load chamber is located in the upper portion of said process apparatus, and said process chamber is located in the lower portion of said process apparatus.
10 . The method of claim 7 , wherein said process apparatus has first and second openings for loading and unloading said substrate, and wherein said first opening is opposed to said second opening.
11 . The method of claim 7 , wherein said process apparatus is cylindrical and has symmetric interfaces.
12 . The method of claim 7 , wherein said treating step comprises performing PVD processing to said substrate.