Semiconductor device
View Patent ↗A lateral high-breakdown voltage semiconductor device is provided in which the breakdown voltages of elements as a whole are improved, while suppressing increases in cell area. A track-shape gate electrode surrounds a collector electrode extending in a straight line, a track-shape emitter electrode surrounds the gate electrode, and a track-shape first isolation trench surrounds the emitter electrode. A second isolation trench surrounds the first isolation trench. The region between the first isolation trench and the second isolation trench is an n-type isolation silicon region. The isolation silicon region is at the same potential as the emitter electrode. In the cross-sectional configuration traversing the gate electrode, the depth of the p base region in an interval corresponding to an arc-shape portion of the gate electrode is shallower than the depth of the p base region in an interval corresponding to a straight-line portion of the gate electrode.
1. A semiconductor device, including a dielectric isolation structure including an insulating film extending in a depth direction, the device having a planar layout and comprising:
a compound structure having a plurality of unit structures comprising a first semiconductor region of a first conduction type provided on a supporting substrate with a buried insulating layer intervening, and surrounding a straight-line first electrode, a closed planar-shape gate electrode surrounding the first semiconductor region, and a closed planar-shape second electrode surrounding the gate electrode;
a second semiconductor region of a first or second conduction type, provided in a surface region of the first semiconductor region along the first electrode, and electrically connected to the first electrode;
a third semiconductor region of a second conduction type, provided in a surface region of the first semiconductor region along the second electrode, separated from the second semiconductor region, and electrically connected to the second electrode, the third semiconductor region having a planar shape which has straight-line portions connected by arc-shaped portions;
a fourth semiconductor region of a first conduction type, provided in a surface region of the third semiconductor region along the second electrode, and electrically connected to the second electrode;
the gate electrode being provided on the surface of the third semiconductor region between the fourth semiconductor region and the first semiconductor region, with a gate insulating film intervening;
a closed planar-shape first dielectric isolation region surrounding the compound structure;
a closed planar-shape isolation semiconductor region of a first conduction type, provided on the side opposite the first semiconductor region, with the first dielectric isolation region intervening, the isolation semiconductor region surrounding the first dielectric isolation region; and,
a closed planar-shape second dielectric isolation region surrounding the isolation semiconductor region;
a local insulating film provided in contact with and on the outside of the third semiconductor region positioned on the outermost side of a compound structure having a plurality of unit structures comprising the second semiconductor region, the third semiconductor region, the fourth semiconductor region, the first electrode, the second electrode, and the gate electrode;
the first dielectric isolation region extending from the local insulating film, penetrating the first semiconductor region, and reaching the buried insulating layer; and
a third electrode, held at the same potential as the second electrode, and electrically connected to the isolation semiconductor region, wherein a depth of the third semiconductor region positioned on the outermost side of the compound structure is shallower than a depth of other third semiconductor regions,
wherein the outermost straight-line portions of the third semiconductor region are shallower in depth than the rest of the straight-line portion of the third semiconductor region which is between the outermost portions.
2. The semiconductor device according to claim 1 , wherein the planar shape of the third semiconductor region in each unit structure has straight-line portions extending along the first electrode and arc-shape portions connecting ends of the adjacent straight-line portions, and wherein the depth of the third semiconductor region at the arc-shape portions is shallower than the depth of the straight-line portions of the third semiconductor region positioned outermost in the compound structure.
3. The semiconductor device according to claim 2 , wherein a length of portions of contact of the third semiconductor region at the arc-shape portions and the gate insulating film is longer than a length of portions of contact of the third semiconductor region at the straight-line portions and the gate insulating film.