IP Library Granted Patent US 7,834,446
Granted Patent B2
US 7,834,446 · App. 12/415,657 · Granted Nov 16, 2010

Electronic device and method for coping with electrostatic discharge

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Quick Facts
Patent No.
US 7,834,446
App. No.
12/415,657
Granted
Nov 16, 2010
Kind
B2
Abstract

According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.

Claims (19)

1. An electronic device comprising:

a semiconductor device arranged on a substrate board;

a heat sink arranged on the semiconductor device and cooling the semiconductor device;

a first conductive portion arranged on the substrate board and electrically connected to the heat sink; and

a second conductive portion arranged on the substrate board, the second conductive portion being separated from the first conductive portion by a discharge gap and being grounded.

2. The electronic device of claim 1 ,

wherein the heat sink is electrically connected with the first conductive portion through a fixing member that fixes the heat sink.

3. The electronic device of claim 1 ,

wherein the heat sink is electrically connected with the first conductive portion through a spring member.

4. The electronic device of claim 1 , wherein

at least one of the first conductive portion and the second conductive portion comprises a sharp portion at the discharge gap.

5. The electronic device of claim 1 , further comprising a tuner module that receives a broadcast wave.

6. The electronic device of claim 1 , further comprising:

a case that accommodates the heat sink and the semiconductor device,

wherein the case comprises a slit arranged near the heat sink.

7. The electronic device of claim 1 ,

wherein the heat sink is not electrically connected with the semiconductor device.

8. The electronic device of claim 5 ,

wherein the semiconductor device comprises a decoder module that decodes the broadcast wave received by the tuner module.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2020
From: TOSHIBA VISUAL SOLUTIONS CORPORATION
To: HISENSE VISUAL TECHNOLOGY CO., LTD.
Reel/Frame 051493/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA VISUAL SOLUTIONS CORPORATION
Reel/Frame 045647/0834 →