Assembly with a printed circuit board
View Patent ↗An assembly ( 10 ) comprises a housing ( 11 ) and a printed circuit board ( 14 ) received in the housing. The housing includes a housing body ( 12 ) and a cover ( 16 ). The housing body ( 12 ) has a first surface ( 26 ) supporting the printed circuit board ( 14 ) and also has a portion defining a second surface ( 22 ) receiving the cover ( 16 ). At least the portion of the housing body is formed of a material that is meltable by a laser welder. The second surface ( 22 ) is spaced from the first surface ( 26 ) by a distance that is at least as great as a thickness of the printed circuit board ( 14 ). The printed circuit board ( 14 ) is at least partially held in place by melted material from said portion.
1. An assembly comprising a housing and a printed circuit board received in the housing, the housing including a housing body and a cover, the housing body having a first surface supporting the printed circuit board, the housing body also having a portion defining a second surface receiving the cover, at least said portion of the housing body being formed of a material that is meltable by a laser welder, the second surface being spaced from the first surface by a distance that is at least as great as a thickness of the printed circuit board, the printed circuit board being at least partially held in place by melted material from said portion wherein at least one projection is formed on the cover to engage the printed circuit board and help clamp the printed circuit board in the housing.
2. The assembly of claim 1 wherein the printed circuit board is free from damage caused by said melted material.
3. The assembly of claim 1 wherein the cover is joined to the housing body by melted material from said portion.
4. The assembly of claim 1 wherein the cover has a third surface that is received and supported on the second surface of the housing body, the at least one projection formed on the cover having a fourth surface to engage the printed circuit board and help clamp the printed circuit board in the housing.
5. The assembly of claim 4 wherein the cover has a main portion and the third and fourth surfaces are spaced from the main portion, the third surface being spaced from the main portion by a distance that is at least as great as a distance by which the fourth surface is spaced from the main portion.
6. The assembly of claim 4 wherein the cover has a main portion, a lip extending at an angle away from the main portion around a periphery of the cover, and a flange projecting from the lip in a direction away from the lip and the main portion, the third surface being formed on the flange, the at least one projection being disposed adjacent to the lip and the flange.
7. The assembly of claim 4 wherein the fourth surface is disposed generally parallel to the third surface and in a plane in which the third surface is also generally disposed.
8. An assembly comprising a housing and a printed circuit board received in the housing, the housing including a housing body and a cover,
the housing body having a first surface supporting the printed circuit board, the housing body also having a portion defining a second surface receiving the cover, at least said portion of the housing body being formed of a material that is meltable by a laser welder so that the cover is at least partially held in place by melted material from said portion,
the cover having a main portion and a third surface that is spaced from the main portion, the third surface being received and supported on the second surface of the housing body, the cover also having a fourth surface that is spaced from the main portion, the fourth surface engaging the printed circuit board to help clamp the printed circuit board in the housing, the third surface being spaced from the main portion by a distance that is at least as great as a distance by which the fourth surface is spaced from the main portion.
9. The assembly of claim 8 wherein the cover also has (a) a projection, (b) a lip extending at an angle away from the main portion around a periphery of the cover and (c) a flange projecting from the lip in a direction away from the lip and the main portion, the third surface being formed on the flange and the fourth surface being formed on the projection, the projection being disposed adjacent to the lip and the flange.
10. The assembly of claim 8 wherein the fourth surface is disposed generally parallel to the third surface and in a plane in which the third surface is also generally disposed.
11. An assembly comprising a housing and a printed circuit board received in the housing, the housing including a housing body and a cover, the housing body having a first surface supporting the printed circuit board, the housing body also having a portion defining a second surface receiving the cover, at least said portion of the housing body being formed of a material that is meltable by a laser welder, the second surface being spaced from the first surface by a distance that is at least as great as a thickness of the printed circuit board, the printed circuit board being at least partially held in place by melted material from said portion wherein at least one projection is formed on an interior surface of the housing body to engage the printed circuit board and help clamp the printed circuit board in the housing.