Power semiconductor device with a reduced dynamic avalanche effect and subsequent local heating
View Patent ↗A power semiconductor device includes a first layer of a first conductivity type, which has a first main side and a second main side opposite the first main side. A second layer of a second conductivity type is arranged in a central region of the first main side and a fourth electrically conductive layer is arranged on the second layer. On the second main side a third layer with a first zone of the first conductivity type with a higher doping than the first layer is arranged followed by a fifth electrically conductive layer. The area between the second layer and the first zone defines an active area. The third layer includes at least one second zone of the second conductivity type, which is arranged in the same plane as the first zone. A sixth layer of the first conductivity type with a doping, which is lower than that of the first zone and higher that that of the first layer, is arranged between the at least one second zone and the first layer.
1. A method of arrangement of a power semiconductor device, comprising:
arranging a first main side of a first layer of a first conductivity type opposite a second main side of the first layer of a first conductivity type;
arranging in a central region of the first main side a second layer of a second conductivity type;
arranging a fourth electrically conductive layer on the second layer on the side opposite the first layer;
arranging on the second main side a third layer which comprises a first zone of the first conductivity type with a higher doping than the first layer, the third layer comprising a second zone of the second conductivity type, which is arranged in the same plane as the first zone and which second zone surrounds the first zone, the area between the second layer and the first zone defining an active area;
arranging a fifth electrically conductive layer on the third layer on the side opposite the first layer, the fifth electrically conductive layer covering a side of the third layer which lies opposite the first layer;
arranging between the second zone and the first layer a sixth layer of the first conductivity type with a doping, which is lower than that of the first zone and higher than that of the first layer and
arranging the second zone in a lateral distance from the first zone, and arranging the sixth layer in the region between the first zone and the second zone.
2. A power semiconductor device with a first layer of a first conductivity type, which has a first main side and a second main side opposite the first main side, a second layer of a second conductivity type, which is arranged in a central region of the first main side, a fourth electrically conductive layer, which is arranged on the second layer on the side opposite the first layer, a third layer, which is arranged on the second main side and which comprises a first zone of the first conductivity type with a higher doping than the first layer, and a fifth electrically conductive layer, which is arranged on the third layer on the side opposite the first layer, the area between the second layer and the first zone defining an active area, wherein
the third layer comprises a second zone of the second conductivity type, which is arranged in the same plane as the first zone and which second zone completely surrounds the first zone, wherein
a sixth layer of the first conductivity type with a doping, which is lower than that of the first zone and higher than that of the first layer, is arranged between the second zone and the first layer, wherein
the fifth electrically conductive layer completely covers that side of the third layer, which lies opposite the first layer and wherein
the second zone is arranged in a lateral distance from the first zone, and the sixth layer is arranged in the region between the first zone and the second zone.
3. The semiconductor device according to claim 2 , wherein the width of the first zone is larger than the width of the second layer on at least one side by a width difference.
4. The semiconductor device according to claim 2 , wherein the first zone comprises third zones of the second conductivity type.
5. The semiconductor device according to claim 2 , wherein protection regions of the second conductivity type are arranged on the first main side in a region around the second layer.
6. The semiconductor device according to claim 2 , wherein the first zone is arranged symmetrically to the second layer and/or to the fourth electrically conductive layer.
7. The semiconductor device according to claim 2 , wherein the second zone is arranged directly adjacent to the first zone.
8. The semiconductor device according to claim 7 , wherein the second zone completely covers the fifth electrically conductive layer on its side towards the first layer around the active area.
9. The semiconductor device according to claim 7 , wherein the first zone is arranged symmetrically to the second layer and/or to the fourth electrically conductive layer.
10. The semiconductor device according to claim 7 , wherein the width of the first zone is larger than the width of the second layer on at least one side by a width difference.
11. The semiconductor device according to claim 7 , wherein the first zone comprises third zones of the second conductivity type.
12. The semiconductor device according to claim 7 , wherein protection regions of the second conductivity type are arranged on the first main side in a region around the second layer.