Method of manufacturing semiconductor device
View Patent ↗Of three chips ( 2 A), ( 2 B), and ( 2 C) mounted on a main surface of a package substrate ( 1 ) in a multi-chip module (MCM), a chip ( 2 A) with a DRAM formed thereon and a chip ( 2 B) with a flash memory formed thereon are electrically connected to wiring lines ( 5 ) of the package substrate ( 1 ) through Au bumps ( 4 ), and a gap formed between main surfaces (lower surfaces) of the chips ( 2 A), ( 2 B) and a main surface of the package substrate ( 1 ) is filled with an under-fill resin ( 6 ). A chip ( 2 C) with a high-speed microprocessor formed thereon is mounted over the two chips ( 2 A) and ( 2 B) and is electrically connected to bonding pads ( 9 ) of the package substrate ( 1 ) through Au wires ( 8 ).
1. A semiconductor device comprising:
a wiring substrate having a main surface, a first electrode pad formed on the main surface, a second electrode pad formed on the main surface, and a back surface opposite the main surface;
a first semiconductor chip having a first main surface, a first bonding pad formed on the first main surface, and a first back surface opposite the first main surface, and mounted over the main surface of the wiring substrate such that the first main surface of the first semiconductor chip faces the main surface of the wiring substrate;
a bump electrically connecting the first bonding pad with the first electrode pad;
a second semiconductor chip having a second main surface, a second bonding pad formed on the second main surface, and a second back surface opposite the second main surface, and mounted over the first semiconductor chip such that the second back surface of the second semiconductor chip faces the first back surface of the first semiconductor chip;
a wire electrically connecting the second bonding pad with the second electrode pad;
a first resin sealing the bump and between the first main surface of the first semiconductor chip and the main surface of the wiring substrate; and
a second resin sealing the first semiconductor chip, the second semiconductor chip, and the wire;
wherein a part of the second back surface of the second semiconductor chip is exposed from the first semiconductor chip in a plan view; and
wherein the second resin is contacted with the part of the second back surface of the second semiconductor chip.
2. The semiconductor device according to claim 1 , wherein the first resin is not contacted with the part of the second back surface of the semiconductor chip.
3. The semiconductor device according to claim 1 , wherein the first semiconductor chip has a side surface formed between the first main surface and the first back surface, and wherein the second resin is contacted with the side surface of the first semiconductor chip.
4. The semiconductor device according to claim 1 , wherein a part of the second main surface of the second semiconductor chip is protruded from a peripheral portion of the first semiconductor chip in a plan view.
5. The semiconductor device according to claim 4 , wherein the second bonding pad is formed at the part of the second main surface of the second semiconductor chip.
6. The semiconductor device according to claim 5 , wherein a protruding length of the part of the second main surface of the second semiconductor chip is less than or equal to 1.5 mm.
7. The semiconductor device according to claim 1 , wherein the wiring substrate has a third electrode pad formed on the back surface, and wherein an external terminal is formed on the third electrode pad.
8. The semiconductor device according to claim 1 , wherein a DRAM or a flash memory is formed in the first semiconductor chip, and wherein a microprocessor is formed in the second semiconductor chip.