IP Library Granted Patent US 8,426,863
Granted Patent B2
US 8,426,863 · App. 12/420,769 · Granted Apr 23, 2013

Thin film transistor; method of manufacturing same; and organic light emitting device including the thin film transistor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,426,863
App. No.
12/420,769
Granted
Apr 23, 2013
Kind
B2
Abstract

A thin film transistor according to one or more embodiments of the present invention includes: an insulation substrate; a gate electrode formed on the substrate; a gate insulating layer formed on the gate electrode; a semiconductor formed on the gate insulating layer and having a pair of openings facing each other; ohmic contact layers formed in the openings and including a conductive impurity; and a source electrode and a drain electrode in contact with their respective ohmic contact layers. An organic light emitting device in accordance with an embodiment includes: a first signal line and a second signal line intersecting each other on an insulation substrate; a switching thin film transistor connected to the first signal line and the second signal line; a driving thin film transistor connected to the switching thin film transistor; and a light emitting diode (LED) connected to the driving thin film transistor.

Claims (11)

1. A thin film transistor comprising:

an insulation substrate;

a gate electrode formed on the substrate;

a gate insulating layer formed on the gate electrode;

a semiconductor formed on the gate insulating layer and having a pair of openings;

ohmic contact layers formed in the openings and including a conductive impurity; and

a source electrode and a drain electrode contacting the ohmic contact layers,

wherein the semiconductor includes an extrinsic region disposed adjacent to the ohmic contact layer and including the same impurity as that of the ohmic contact layer; and

wherein the extrinsic region of the semiconductor has a width less than 1/100 of a width of the semiconductor between the ohmic contact layers.

2. The thin film transistor of claim 1 , wherein the extrinsic region of the semiconductor has the impurity at a lower concentration than that of the ohmic contact layer.

3. The thin film transistor of claim 1 , wherein the semiconductor is made of a crystalline silicon.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029008/0744 →