Printhead assembly having angled nested structure
View Patent ↗A printhead assembly includes an elongate ink distribution assembly defining elongate ink ducts from which ink transfer ports extend. The ink distribution assembly further defines a recess in which a laminated stack structure is received in fluid communication with the ink transfer ports. The laminated stack structure has layers between which ink channels in fluid communication with the ports are interleaved. The laminated stack defines at least one cavity in which respective ink ejection print head integrated circuits (ICs) can be received in fluid communication with the ink channels. The cavity is formed in the laminated stack structure so that the ICs can be disposed at a slight angle to the longitudinal axis of the ink distribution assembly.
1. A printhead assembly comprising:
an elongate ink distribution assembly defining elongate ink ducts from which ink transfer ports extend, the ink distribution assembly further defining a recess in which a laminated stack structure is received in fluid communication with the ink transfer ports; and
the laminated stack structure having layers between which ink channels in fluid communication with the ports are interleaved, the laminated stack defining at least one cavity in which respective ink ejection print head integrated circuits (ICs) are received in fluid communication with the ink channels,
wherein said cavity is formed in said laminated stack structure so that the ICs are disposed at a slight angle to the longitudinal axis of the ink distribution assembly.
2. A printhead assembly as claimed in claim 1 , wherein the elongate ink distribution assembly includes:
a distribution molding defining the ink ducts which are substantially parallel; and
a plastics duct cover which forms a lid for the distribution molding.
3. A printhead assembly as claimed in claim 2 , wherein ink inlet ports are integrally molded with the plastics duct cover so that ink can be supplied to the ink ducts.
4. A printhead assembly as claimed in claim 1 , wherein said formation of the cavities is such that an overlap can be provided between each IC to enable continuous transmission of ink over the entire length of the ink distribution assembly.