Optical communication module and flexible printed circuit board
View Patent ↗A flexible printed circuit board includes: a signal wiring pattern including: a transmission line for connecting an end of an optical device with an end of a signal generation circuit; and another transmission line for connecting another end of the optical device with another end of the signal generation circuit; a thin film resistor layer formed in a region including a region facing the signal wiring pattern so as to constitute a first microstrip line together with each of the transmission lines; a ground conductor formed in a region except a part of a region facing the thin film resistor layer within a region including a region facing the signal wiring pattern so as to constitute a second microstrip line together with each of the transmission lines; and an insulating layer formed between each two of the signal wiring pattern, the thin film resistor layer, and the ground conductor.
1. An optical communication module, comprising:
an optical device;
a main board incorporating a signal generation circuit for generating a high frequency signal corresponding to an optical signal converted by the optical device; and
a flexible printed circuit board for connecting the optical device with the main board,
wherein the flexible printed circuit board comprises:
a signal wiring pattern comprising:
a first transmission line for connecting an end of the optical device with an end of the signal generation circuit; and
a second transmission line for connecting another end of the optical device with another end of the signal generation circuit;
a thin film resistor layer formed in a region including at least a part of a region facing the signal wiring pattern so as to constitute a first microstrip line together with each of the first transmission line and the second transmission line;
a ground layer formed in a region except a part of a region facing the thin film resistor layer within a region including a region facing the signal wiring pattern so as to constitute a second microstrip line together with the each of the first transmission line and the second transmission line; and
an insulating layer formed between each two of the signal wiring pattern, the thin film resistor layer, and the ground layer.
2. An optical communication module according to claim 1 , wherein the signal wiring pattern is formed so that a space between the first transmission line and the second transmission line in a part facing the thin film resistor layer is smaller than a space in another part.
3. An optical communication module according to claim 2 , wherein the first transmission line and the second transmission line are formed so that a width of the part facing the thin film resistor layer is larger than a width of the another part.
4. An optical communication module according to claim 1 , wherein the ground layer is formed so that the part of the region facing the thin film resistor layer is an opening part.
5. An optical communication module according to claim 1 , wherein the ground layer, the thin film resistor layer, and the signal wiring pattern are laminated in the stated order sandwiching the insulating layer.
6. An optical communication module according to claim 1 , wherein the ground layer, the signal wiring pattern, and the thin film resistor layer are laminated in the stated order sandwiching the insulating layer.
7. An optical communication module according to claim 1 , wherein the thin film resistor layer, the ground layer, and the signal wiring pattern are laminated in the stated order sandwiching the insulating layer.
8. A flexible printed circuit board for connecting an optical device with a main board incorporating a signal generation circuit for generating a high frequency signal corresponding to an optical signal converted by the optical device, the flexible printed circuit board comprising:
a signal wiring pattern comprising:
a first transmission line for connecting an end of the optical device with an end of the signal generation circuit; and
a second transmission line for connecting another end of the optical device and another end of the signal generation circuit;
a thin film resistor layer formed in a region including at least a part of a region facing the signal wiring pattern so as to constitute a first microstrip line together with each of the first transmission line and the second transmission line;
a ground layer formed in a region except a part of a region facing the thin film resistor layer within a region including a region facing the signal wiring pattern so as to constitute a second microstrip line together with the each of the first transmission line and the second transmission line; and
an insulating layer formed between each two of the signal wiring pattern, the thin film resistor layer, and the ground layer.