IP Library Granted Patent US 8,237,836
Granted Patent B2
US 8,237,836 · App. 12/424,150 · Granted Aug 7, 2012

Solid-state image sensor device and differential interface thereof

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Quick Facts
Patent No.
US 8,237,836
App. No.
12/424,150
Granted
Aug 7, 2012
Kind
B2
Abstract

A solid-state image sensor device and a differential interface thereof that are capable of ensuring stable transmission of image data while reducing power consumption. In an aspect of the present invention, a solid-state image sensor device comprises an image sensor section for outputting analog signals of an image being taken; a plurality of AD converter sections, arranged with respect to the column direction of the image sensor section, for converting the analog signals into digital signals; a drive circuit section for controlling the image sensor section and the AD converter sections; and a plurality of differential interface sections for transmitting the digital signals converted by the AD converter sections as differential output signals to an external device. Further, each of the differential interface sections comprises a current value changeover circuit for selecting a constant current to be applied in each differential interface section in accordance with each of a plurality of operation modes, and an offset voltage holding circuit for maintaining a constant offset voltage level for the differential output signals even when an operation mode changeover is made.

Claims (49)

1. A solid-state image sensor device comprising:

an image sensor section for outputting analog signals of an image being taken;

a plurality of AD converter sections, arranged with respect to the column direction of said image sensor section, for converting said analog signals into digital signals;

a drive circuit section for controlling said image sensor section and said AD converter sections; and

a plurality of differential interface sections for transmitting said digital signals converted by said AD converter sections as differential output signals to an external device;

wherein each of said differential interface sections comprises:

a current value changeover circuit for selecting a constant current to be applied in each said differential interface section in accordance with each of a plurality of operation modes; and

an offset holding circuit for maintaining an offset voltage at a constant level for said differential output signals even when an operation mode changeover is made.

2. A solid-state image sensor device according to claim 1 ,

wherein said offset voltage holding circuit comprises a plurality of NMOSs each having a gate for receiving a voltage capable of maintaining said offset voltage at a constant level in each of said operation modes, and

wherein said NMOSs are arranged to be changed over in accordance with each of said operation modes.

3. A solid-state image sensor device according to claim 1 ,

wherein said offset voltage holding circuit comprises a resistor element capable of maintaining said offset voltage at a constant level in each of said operation modes, and

wherein said resistor element being arranged to be changed over in accordance with each of said operation modes.

4. A solid-state image sensor device according to claim 3 ,

wherein said offset voltage holding circuit comprises a plurality of said resistor elements corresponding to said operation modes respectively, and

wherein said resistor elements are changed over for adjusting said offset voltage in each of said operation modes.

5. A solid-state image sensor device according any one of claims 1 to 4 ,

wherein said differential interface section comprises a differential interface circuit for transferring said digital signals, and a differential interface circuit for transferring a clock signal, and

wherein said differential interface circuit for transferring said clock signal provides a constant current having a higher value than that in said differential interface circuit for transferring said digital signals.

6. A solid-state image sensor device according to claims 1 ,

wherein said differential interface section further comprises a transmission monitor circuit for monitoring an intermediate potential on a transmission line used for transmitting said differential output signals in order to check for readiness for transmission, and

wherein said current value changeover circuit further provides an operation mode for cutting off said constant current.

7. A solid-state image sensor device according to claim 1 ,

wherein said differential interface sections are arranged into groups on a predetermined criterial basis, and a bias voltage adjusted through an analog buffer is applied to each of said differential interface sections included in each group.

8. A solid-state image sensor device according to claim 1 ,

wherein at least a part of said differential interface sections is arranged on a space between adjacent input/output areas of said solid-state image sensor device.

9. A solid-state image sensor device comprising:

an image sensor section for outputting analog signals of an image being taken;

a plurality of AD converter sections, arranged with respect to the column direction of said image sensor section, for converting said analog signals into digital signals;

a drive circuit section for controlling said image sensor section and said AD converter sections; and

a plurality of differential interface sections for transmitting said digital signals converted by said AD converter sections as differential output signals to an external device;

wherein said differential interface sections are arranged into groups on a predetermined criterial basis, and a bias voltage adjusted through an analog buffer is applied to each of said differential interface sections included in each group.

10. A solid-state image sensor device comprising:

an image sensor section for outputting analog signals of an image being taken;

a plurality of AD converter sections, arranged with respect to the column direction of said image sensor section, for converting said analog signals into digital signals;

a drive circuit section for controlling said image sensor section and said AD converter sections; and

a plurality of differential interface sections for transmitting said digital signals converted by said AD converter sections as differential output signals to an external device;

wherein at least a part of said differential interface sections is arranged on a space between adjacent input/output areas of said solid-state image sensor device.

11. A differential interface for transmitting digital signals as differential output signals to an external device, said differential interface comprising:

a current value changeover circuit for selecting a constant current to be applied in said differential interface in accordance with each of a plurality of operation modes; and

an offset voltage holding circuit for maintaining an offset voltage at a constant level for said differential output signals even when an operation mode changeover is made.

12. A solid-state image sensor device comprising:

a differential interface section for transmitting digital signals as differential output signals to an external device; and

a plurality of input/output areas including pads through which said differential output signals are transmitted to said external device;

wherein said differential interface section is arranged on a space between adjacent first and second input/output areas of said plural input/output areas.

13. A solid-state image sensor device according to claim 12 ,

wherein said first input/output area, said differential interface, and said second input/output area are arranged successively in a first direction, and

wherein a topological interval between a first pad included in said first input/output area and a second pad included in said second input/output area is larger than the sum of the dimension of said first input/output area in said first direction and the dimension of said second input/output area in said first direction.

Assignments (2)
CHANGE OF NAME Recorded Jun 24, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024591/0446 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2009
From: SHIMANO, HIROKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 022549/0472 →