Apparatus and methods for manufacturing thin-film solar cells
View Patent ↗Improved methods and apparatus for forming thin-film layers of semiconductor material absorber layers on a substrate web. According to the present teachings, a semiconductor layer may be formed in a multi-zone process whereby various layers are deposited sequentially onto a moving substrate web.
1. An assembly for physical vapor deposition on to a moving web, comprising:
an apparatus for translating a flexible substrate through a processing path between roll-out and roll-up devices,
a first insulated vessel located below the processing path for containing material to be evaporated on to the substrate as it translates along the processing path,
a lid on the vessel, the vessel and the lid forming a container, the lid defining an upper plane of the container, a first direction being defined perpendicular to the upper plane and vertically upward away from the container toward the processing path, and
a heating element connected to an electrical source, the heating element being positioned in the lid and forming an array of nozzles for depositing material on to a moving substrate, each nozzle having an internal wall which is part of the heating element, wherein each nozzle is formed by two corresponding C-shaped wall portions, each C-shaped wall portion being a piece of the heating element, wherein each corresponding pair of C-shaped wall portions is separated by two gaps filled with dielectric material.
2. The assembly of claim 1 , further including a first plane being defined perpendicular to the lid, parallel to the processing path and bisecting the lid, wherein the array includes two effusion ports, oppositely and equidistantly located with respect to the first plane.
3. The assembly of claim 1 , wherein the processing path has a central region between lateral regions, nozzles in the array being spaced across the processing path, the spacing between nozzles in the center region of the processing path being greater than spacing between nozzles near in the lateral regions of the processing path.
4. The assembly of claim 1 , wherein the effusion ports are distributed to provide uniform deposition of material across a substantial width portion of the substrate.
5. An assembly for physical vapor deposition on to a moving web, comprising:
an apparatus for translating a flexible substrate through a processing path between roll-out and roll-up devices,
a first insulated vessel located below the processing path for containing material to be evaporated on to the substrate as it translates along the processing path,
a lid on the vessel, the vessel and the lid forming a container, the lid defining an upper plane of the container, a first direction being defined perpendicular to the upper plane and vertically upward away from the container toward the processing path, and
a heating element connected to an electrical source, the heating element being positioned in the lid and forming an array of effusion ports for depositing material on to a moving substrate, each port having an internal wall which is part of the heating element, wherein the heating element defines a continuous conductive path between first and second electrical contacts, the heating element having multiple discrete raised thickness portions separated by thinner linear portions along the conductive path, each raised thickness portion being matched up with another raised thickness portion to form a nozzle projecting in the first direction for directing vapor from the container toward the processing path,
wherein each nozzle has an interior wall, the wall having gaps filled with dielectric material between corresponding raised thickness portions of the heating element.
6. The assembly of claim 5 , wherein the heating element has an elongate axis and a transverse axis perpendicular to the elongate axis, the transverse axis passing between the electrical contacts, the heating element being symmetrical relative to the transverse axis and defining at least one nozzle on each side of the transverse axis.
7. The assembly of claim 5 , wherein each corresponding pair of raised thickness portions is separated along the conductive path by a hair-pin turn portion of the heating element.
8. The assembly of claim 5 , further including a first plane being defined perpendicular to the lid, parallel to the processing path and bisecting the lid, wherein the array includes two effusion ports, oppositely and equidistantly located with respect to the first plane.
9. The assembly of claim 5 , wherein the processing path has a central region between lateral regions, nozzles in the array being spaced across the processing path, the spacing between nozzles in the center region of the processing path being greater than spacing between nozzles near in the lateral regions of the processing path.
10. The assembly of claim 5 , wherein the effusion ports are distributed to provide uniform deposition of material across a substantial width portion of the substrate.
11. An assembly for physical vapor deposition onto a moving web, comprising:
an apparatus for translating a flexible substrate through a processing path between roll-out and roll-up devices,
a first insulated vessel located below the processing path for containing material to be evaporated on to the substrate as it translates along the processing path,
a lid on the vessel, the vessel and the lid forming a container, the lid defining an upper plane of the container, a first direction being defined perpendicular to the upper plane and vertically upward away from the container toward the processing path, and
a heating element connected to an electrical source, the heating element being positioned in the lid and forming an array of effusion ports for depositing material on to a moving substrate, each port having an internal wall which is part of the heating element, wherein the heating element has a base, the base having a thickness defined in the first direction, and each effusion port including a nozzle wall having a port height extending beyond the base in the first direction,
wherein each nozzle wall is formed by two corresponding C-shaped wall portions, each C-shaped wall portion being a piece of the heating element, wherein each corresponding pair of C-shaped wall portions is separated by two gaps, and
wherein the gaps between corresponding C-shaped wall portions are filled with dielectric material.
12. The assembly of claim 11 , further including a first plane being defined perpendicular to the lid, parallel to the processing path and bisecting the lid, wherein the array includes two effusion ports, oppositely and equidistantly located with respect to the first plane.
13. The assembly of claim 11 , wherein the processing path has a central region between lateral regions, nozzles in the array being spaced across the processing path, the spacing between nozzles in the center region of the processing path being greater than spacing between nozzles near in the lateral regions of the processing path.
14. The assembly of claim 11 , wherein the effusion ports are distributed to provide uniform deposition of material across a substantial width portion of the substrate.
15. An assembly for physical vapor deposition on to a moving web, comprising:
an apparatus for translating a flexible substrate through a processing path between roll-out and roll-up devices,
a first insulated vessel located below the processing path for containing material to be evaporated on to the substrate as it translates along the processing path,
a lid on the vessel, the vessel and the lid forming a container, the lid defining an upper plane of the container, a first direction being defined perpendicular to the upper plane and vertically upward away from the container toward the processing path, and
a heating element connected to an electrical source, the heating element being positioned in the lid and forming an array of effusion ports for depositing material on to a moving substrate, each port having an internal wall which is part of the heating element, wherein the heating element has a base, the base having a thickness defined in the first direction, and each effusion port including a nozzle wall having a port height extending beyond the base in the first direction,
wherein the heating element defines a continuous conductive path between first and second electrical contacts, the heating element having multiple discrete raised thickness portions separated by thinner linear portions along the conductive path, each raised thickness portion being matched up with another raised thickness portion to form a nozzle projecting in the first direction for directing vapor from the container toward the processing path,
wherein each nozzle has an interior wall, the wall having gaps between corresponding raised thickness portions of the heating element, and
wherein the gaps between corresponding raised thickness portions are filled with dielectric material.
16. The assembly of claim 15 , wherein the heating element has an elongate axis and a transverse axis perpendicular to the elongate axis, the transverse axis passing between the electrical contacts, the heating element being symmetrical relative to the transverse axis and defining at least one nozzle on each side of the transverse axis.
17. The assembly of claim 15 , wherein each corresponding pair of raised thickness portions is separated along the conductive path by a hair-pin turn portion of the heating element.
18. The assembly of claim 15 , further including a first plane being defined perpendicular to the lid, parallel to the processing path and bisecting the lid, wherein the array includes two effusion ports, oppositely and equidistantly located with respect to the first plane.
19. The assembly of claim 15 , wherein the processing path has a central region between lateral regions, nozzles in the array being spaced across the processing path, the spacing between nozzles in the center region of the processing path being greater than spacing between nozzles near in the lateral regions of the processing path.
20. The assembly of claim 15 , wherein the effusion ports are distributed to provide uniform deposition of material across a substantial width portion of the substrate.