Apparatus and methods for manufacturing thin-film solar cells
View Patent ↗Improved methods and apparatus for forming thin-film layers of semiconductor material absorber layers on a substrate web. According to the present teachings, a semiconductor layer may be formed in a multi-zone process whereby various layers are deposited sequentially onto a moving substrate web.
1. A method of depositing a thin film semiconductor layer onto a flexible substrate, comprising:
transporting a substrate web through a multi-zone deposition region,
depositing onto the web, within a first substantially enclosed gallium indium deposition zone, a first layer of gallium indium in the presence of selenium gas,
depositing onto the web, after depositing the first layer of gallium indium and within a first substantially enclosed copper deposition zone, a first layer of copper in the presence of selenium gas,
depositing onto the web, after depositing the first layer of copper and within a second substantially enclosed copper deposition zone, a second layer of copper in the presence of selenium gas, and
depositing onto the web, after depositing the second layer of copper and within a second substantially enclosed gallium indium deposition zone, a second layer of gallium indium in the presence of selenium gas.
2. The method of claim 1 , further comprising depositing onto the web, prior to depositing the first layer of gallium indium, a layer of precursor material selected from the group consisting of sodium fluoride, potassium fluoride, lithium fluoride, sodium selenide, sodium selenite and sodium selenate.
3. The method of claim 2 , further comprising
depositing onto the web, after depositing the second layer of copper and within a third substantially enclosed gallium indium deposition zone, a third layer of gallium indium in the presence of selenium gas.
4. The method of claim 3 , further comprising
monitoring a property of a layer deposited on the web between the steps of depositing the first and second layers of copper.
5. The method of claim 4 , further comprising
adjusting an amount of material deposited in the first layer of gallium indium or first layer of copper based on data developed in the monitoring step.
6. The method of claim 5 , wherein the monitoring step is carried out using x-ray fluorescence.
7. The method of claim 6 , wherein the adjusting step includes altering a heating temperature in one of the first two depositing steps.
8. The method of claim 7 , wherein each depositing step includes effusing material from side-by-side sources, the monitoring and adjusting steps being configured to correct layer non-uniformity across the web.
9. The method of claim 5 , wherein the monitoring and adjusting steps are carried out while the web moves continuously through the multi-zone deposition region.
10. The method of claim 4 , further comprising
monitoring a property of a layer deposited on the web after depositing the third layer of gallium indium.
11. The method of claim 10 , further comprising
adjusting an amount of material deposited in one or more of the second layer of copper, the second layer of gallium indium, and the third layer of gallium indium based on data developed in the monitoring step.
12. The method of claim 1 , further comprising monitoring a property of the thin film semiconductor layer after depositing the first layer of copper and prior to depositing the second layer of copper, and adjusting a deposition rate of at least one of the first layer of gallium indium and the first layer of copper based on the monitored property.
13. The method of claim 1 , further comprising depositing onto the web, after depositing the second layer of gallium indium and within a third substantially enclosed gallium indium deposition zone, a third layer of gallium indium in the presence of selenium gas.