Single step current collector deposition process for energy storage devices
The present invention is directed to methods of forming current collectors of an energy storage device. The current collectors can be formed either before forming the anode/cathode, or after forming the anode/cathode. In one embodiment, a current collector material is simultaneously deposited on an anode support structure and a cathode support structure to form an anode current collector and a cathode current collector. In another embodiment, a current collector material is simultaneously deposited on an anode and a cathode to form an anode current collector and a cathode current collector.
1. A method of forming current collectors of an energy storage device comprising:
forming an anode current collector and a cathode current collector that are electrically isolated from each other, the forming of the anode current collector and cathode current collector comprising (i) simultaneously depositing a current collector material on an anode support structure and on a cathode support structure to form the anode current collector and the cathode current collector, respectively, the anode support structure and the cathode support structure each extending from a substrate surface and each having an actual surface area that is greater than twice its geometrical surface area, and (ii) removing deposited current collector material, as necessary, after said simultaneous deposition step to electrically isolate the anode current collector from the cathode current collector.
2. The method of claim 1 , wherein the current collector material is deposited on the anode support structure and on the cathode support structure by electrochemical deposition, electroless deposition, electrophoretic deposition, displacement deposition, or chemical vapor deposition.
3. The method of claim 1 , wherein the current collector material is deposited on the anode support structure and on the cathode support structure by a printing technique or sputter deposition.
4. The method of claim 1 , further comprising sintering the current collector material.
5. The method of claim 1 , further comprising selectively etching the current collector material to electrically isolate the anode current collector from the cathode current collector.
6. The method of claim 1 , further comprising pyrolyzing the current collector material.
7. The method of claim 1 wherein the method further comprises the step of forming an anode on the anode support structure and a cathode on the cathode support structure, and the current collector material is simultaneously deposited on the anode support structure and the cathode support structure by simultaneously depositing the current collector material onto the anode and the cathode formed on the anode support structure and cathode support structure, respectively.
8. The method of claim 7 , wherein the current collector material comprises carbon, nickel or platinum.
9. The method of claim 7 , wherein the current collector material is deposited on the anode and on the cathode by electrochemical deposition, electroless deposition, electrophoretic deposition, displacement deposition, or chemical vapor deposition.
10. The method of claim 7 , wherein the current collector material is deposited on the anode and on the cathode by a printing technique or sputter deposition.
11. The method of claim 7 , further comprising sintering the current collector material.
12. The method of claim 7 , further comprising selectively etching the current collector material to electrically isolate the anode current collector from the cathode current collector.
13. The method of claim 7 , further comprising pyrolyzing the current collector material.
14. The method of claim 7 , wherein the current collector material comprises parylene.
15. The method of claim 6 , wherein the current collector material comprises parylene.
16. The method of claim 1 wherein the deposited current collector material comprises carbon, nickel, platinum, titanium or tantalum.
17. The method of claim 1 wherein the deposited current collector material is alloyed or reacted with the anode, cathode, anode support structure or cathode support structure.
18. The method of claim 1 wherein the anode, cathode, anode support structure or cathode support structure comprises a semiconductor material and the deposited current collector material is alloyed with the semiconductor material.
19. The method of claim 18 wherein the deposited current collector material is nickel.
20. The method of claim 1 wherein the current collector material is simultaneously deposited onto the anode support structure to form an anode current collector and on the cathode support structure to form a cathode current collector, and an anode is formed on the anode current collector and a cathode is formed on the cathode current collector.
21. The method of claim 20 wherein the deposited current collector material comprises carbon, nickel, platinum, titanium or tantalum.
22. The method of claim 20 wherein the deposited current collector material is alloyed or reacted with the anode support structure or the cathode support structure.
23. The method of claim 20 wherein the current collector material is deposited on the anode support structure and on the cathode support structure by electrochemical deposition, electroless deposition, electrophoretic deposition, displacement deposition, or chemical vapor deposition.
24. The method of claim 20 further comprising sintering the current collector material.