Insulation-coated wire
View Patent ↗An insulation-coated wire has a conductor, and a semiconductive layer provided at an outer periphery of the conductor. The semiconductive layer has a resin coating including metal fine particles dispersed in a base resin, in which an average particle diameter of the metal fine particles is not greater than 1 μm.
1. An insulation-coated wire used for a motor or a generator driven by an inverter drive comprising:
a conductor; and
a semiconductive layer for preventing an occurrence of partial discharge provided at an outer periphery of the conductor, the semiconductive layer comprising a resin coating comprising metal fine particles dispersed in a base resin,
wherein an average particle diameter of the metal fine particles is not greater than 1 μm,
wherein each of the metal fine particles comprises an organic aggregation-suppressing layer comprising a surface-activating agent on a surface, and
wherein the surface-activating agent comprises aliphatic amine.
2. The insulation-coated wire according to claim 1 , wherein each of the metal fine particles comprises Ag fine particles.
3. The insulation-coated wire according to claim 1 , wherein each of the metal fine particles comprises Cu fine particles.
4. The insulation-coated wire according to claim 1 , wherein the base resin comprises at least one of a polyesterimide resin, a polyamideimide resin, and a polyimide resin.
5. The insulation-coated wire according to claim 1 , wherein the semiconductive layer further comprises carbon particles dispersed in the base resin.
6. The insulation-coated wire according to claim 1 , wherein the semiconductor layer is formed by coating and baking the resin coating.
7. The insulation-coated wire according to claim 1 , further comprising:
an insulating layer interposed between the conductor and the semiconductive layer.
8. The insulation-coated wire according to claim 1 , further comprising:
a protective layer for protecting the semiconductive layer, the protective layer being provided at an outer periphery of the semiconductive layer.
9. The insulation-coated wire according to claim 1 , wherein a content of the metal fine particles contained in the resin coating for forming the semiconductive layer is 2 to 10% by weight with respect to 100% by weight of the base resin.
10. The insulation-coated wire according to claim 1 , wherein a thickness of the semiconductive layer is 2 to 10 μm.