Method for fabricating a dual workfunction semiconductor device and the device made thereof
View Patent ↗A method for manufacturing a dual workfunction semiconductor device and the device made thereof are disclosed. In one aspect, the method includes manufacturing a first transistor in a first region and a second transistor in a second region of a substrate, the first transistor including a first gate stack, the first gate stack having a first gate dielectric capping layer and a first metal gate electrode layer. The second gate stack is similar to the first gate stack. The method includes applying a first thermal budget to the first gate dielectric capping layer and a second thermal budget to the second gate dielectric capping material to tune the workfunction of the first and second gate stack, the first thermal budget being smaller than the second thermal budget such that after the thermal treatment the first and the second gate stack have different work functions.
1. A method of manufacturing a dual work function semiconductor device comprising:
manufacturing a first transistor in a first region of a semiconductor substrate, the first transistor comprising a first gate stack having a first effective workfunction (WF1 eff ), the first gate stack comprising a first gate dielectric capping layer and a first metal gate electrode layer on and in contact with the first gate dielectric capping layer,
the first gate dielectric capping layer determining the first effective workfunction (WF1 eff );
manufacturing a second transistor in a second region of the substrate, the second transistor comprising a second gate stack having a second effective workfunction (WF2 eff ), the second gate stack comprising a second gate dielectric capping layer and a second metal gate electrode layer on and in contact with the second gate dielectric capping layer, the second metal gate electrode layer being formed from the same metal composition as the first metal gate electrode layer, the second gate dielectric capping layer being formed from the same dielectric material as the first dielectric capping layer, the second gate dielectric capping layer determining the second effective work function (WF2 eff ) being the same as the first effective workfunction (WF1 eff ); and
applying a first thermal budget to at least the first gate dielectric capping layer and a second thermal budget to at least the second gate dielectric capping material, the first thermal budget being smaller than the second thermal budget such that the first effective workfunction (WF1 eff ) is modified into a final first effective workfunction (WF1 eff-final ) and such that the second effective workfunction (WF2 eff ) is modified into a final second effective workfunction (WF2 eff-final ), wherein the final first effective workfunction (WF1 eff-final ) is different from the final second effective work function (WF2 eff-final ).
2. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein
(
WF
1
eff
-
final
-
WF
1
eff
)
(
WF
2
eff
-
final
-
WF
2
eff
)
≤
0.1
with WF1 eff being the first effective workfunction, WF2 eff being the second effective workfunction WF1 eff-final being the final first effective workfunction, WF2 eff-final being the final second effective workfunction.
3. The method of forming a dual workfunction semiconductor device according to claim 2 , wherein the final first effective workfunction (WF1 eff-final ) is substantially equal to the first effective work function (WF1 eff ).
4. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein one of the first or the second transistor is a PMOS transistor and wherein the other one of the first or the second transistor is a NMOS transistor.
5. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein the manufacturing of the first transistor is done using a gate-last approach.
6. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein the first thermal budget is at a temperature lower than about 800 degrees Celsius.
7. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein the manufacturing of the first transistor further comprises:
forming a first dummy gate stack in the first region, the first dummy gate stack comprising a polysilicon gate electrode layer on and in contact with a first gate dielectric host layer;
forming a source/drain region;
removing the polysilicon gate electrode thereby exposing the underlying first gate dielectric host layer;
forming the first gate dielectric capping layer on and in contact with the first gate dielectric host layer; and
forming the first metal gate electrode layer overlying the first gate dielectric capping layer.
8. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein the manufacturing of the second transistor is done using a gate-last approach.
9. The method of forming a dual workfunction semiconductor device according to claim 8 , wherein the manufacturing of the second transistor further comprises:
forming a second dummy gate stack in the second region, the second dummy gate stack comprising a polysilicon gate electrode layer overlying a second gate dielectric host material;
forming a source/drain region; removing the polysilicon gate electrode thereby exposing the underlying second gate dielectric host layer;
forming the second gate dielectric capping layer on and in contact with the second gate dielectric host layer; and
forming the second metal gate electrode layer on and in contact with the second gate dielectric capping layer.
10. The method of forming a dual workfunction semiconductor device according to claim 8 , wherein the process of applying a first thermal budget to the first gate dielectric capping layer and a second thermal budget to the second gate dielectric capping layer further comprises:
providing a heat sensitive layer on the first region after the process of forming the second metal gate electrode layer; and
performing a thermal annealing process of the first region and the second region simultaneously, such that the heat sensitive layer blocks at least part of the temperature resulting in a first thermal budget being smaller than the second thermal budget; removing the heat sensitive layer.
11. The method of forming a dual workfunction semiconductor device according to claim 10 , wherein the heat sensitive layer is a heat reflection layer.
12. The method of forming a dual workfunction semiconductor device according to claim 10 , wherein the heat sensitive layer comprises aluminum.
13. The method of forming a dual workfunction semiconductor device according to claim 10 , wherein the heat sensitive layer is a heat absorption layer.
14. The method of forming a dual workfunction semiconductor device according to claim 10 , wherein the thermal annealing process comprises a laser anneal.
15. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein the first dielectric capping layer and the second dielectric capping layer comprise a lanthanide-based dielectric material.
16. The method of forming a dual workfunction semiconductor device according to claim 1 , wherein the first dielectric capping layer and the second dielectric capping layer comprise an aluminum-based dielectric material.
17. A dual workfunction semiconductor device formed by the method according to claim 1 .