Heat-dissipating component having stair-stepped coolant channels
View Patent ↗A heat-dissipating component including a heat-generating device such as a power semiconductor chip and a mounting structure is provided with coolant channels having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels, and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels. The stair-stepped channels are formed in the heat generating device and/or the mounting structure, and the stepped sidewalls may extend toward or away from the center of the channel.
1. A heat dissipating component comprising:
a heatsink;
a heat-generating device adjacent to the heatsink; and
a coolant channel formed in the component for conducting a coolant to dissipate heat generated by the heat-generating device, where the coolant channel is defined by stair-stepped sidewalls.
2. The heat dissipating component of claim 1 , where:
the coolant channel is partially formed in the heatsink and partially formed in the heat-generating device.
3. The heat dissipating component of claim 1 , where:
the coolant channel is entirely formed in the heatsink.
4. The heat dissipating component of claim 1 , where:
the coolant channel is entirely formed in the heat-generating device.
5. The heat dissipating component of claim 1 , where:
the stair-stepped sidewalls of the coolant channel define at least one sidewall portion that extends toward a center of the channel.
6. The heat dissipating component of claim 1 , where:
the stair-stepped sidewalls of the coolant channel define at least one sidewall portion that extends away from a center of the channel.
7. The heat dissipating component of claim 1 , where:
the heat-generating device and the heatsink are joined by solder or a thermally conductive adhesive.