Method of producing circuit board
View Patent ↗An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process. The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film.
1. A method of producing a circuit board, comprising:
a film-forming step of forming a swellable resin film on the surface of an insulative substrate;
a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film;
a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film;
a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface; and
a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film,
wherein the catalyst-depositing step includes a step of immersing the swellable resin film in an acidic catalyst metal colloidal solution, the film-separating step includes a step of swelling the swellable resin film in an alkaline solution, and the swellable resin film has a swelling degree of 10% or less with respect to the acidic catalyst metal colloidal solution and is capable of swelling in the alkaline solution.
2. The method of producing a circuit board according to claim 1 , wherein the swellable resin film has a swelling degree of 50% or more with respect to the alkaline solution.
3. The method of producing a circuit board according to claim 2 , wherein the swellable resin film is an elastomer selected from the group consisting of diene-based elastomers, acrylic elastomers, and polyester elastomers, the elastomer having carboxyl groups.
4. The method of producing a circuit board according to claim 2 , wherein the swellable resin film contains, as a principal component, a resin including an acrylic resin having carboxyl groups of 100 to 800 acid equivalents.
5. The method of producing a circuit board according to claim 1 , wherein the swellable resin film contains a fluorescent substance, and the method contains an additional inspection step of examining film-separating failure by monitoring emission from the fluorescent substance after the film-separating step.
6. The method of producing a circuit board according to claim 1 , wherein the thickness of the swellable resin film is 10 μm or less.
7. The method of producing a circuit board according to claim 1 , wherein the forming circuit groove in the circuit groove-forming step have a region having width of 20 μm or less.
8. The method of producing a circuit board according to claim 1 , wherein the circuit grooves are formed by laser processing in the circuit groove-forming step.
9. The method of producing a circuit board according to claim 8 , wherein two capacitor-forming electrode grooves facing each other via the insulative substrate-constituting material as dielectric are formed in the insulative substrate for preparation of a capacitor structure in the circuit board in the circuit groove-forming step.
10. The method of producing a circuit board according to claim 1 , wherein the circuit grooves are formed by embossing in the circuit groove-forming step.
11. The method of producing a circuit board according to claim 1 , wherein through-holes are formed in the insulative substrate in the circuit groove-forming step.
12. The method of producing a circuit board according to claim 1 , wherein the insulative substrate has a step-shaped face and the insulative substrate surface is the step-shaped face.