High electron mobility transistor semiconductor device and fabrication method thereof
View Patent ↗In a method of forming a semiconductor device on a semiconductor substrate ( 100 ), a photoresist layer ( 102 ) is deposited on the semiconductor substrate; a window ( 106 ) is formed in the photoresist layer ( 102 ) by electron beam lithography; a conformal layer ( 108 ) is deposited on the photoresist layer ( 102 ) and in the window ( 106 ); and substantially all of the conformal layer ( 108 ) is selectively removed from the photoresist layer ( 102 ) and a bottom portion of the window to form dielectric sidewalls ( 110 ) in the window ( 106 ).
1. A high electron mobility transistor (HEMT) device for a sub-millimeter wave amplifier operating in frequencies from 300 GHz to 3 THz, comprising:
a group III-V substrate;
a first source electrode and a second source electrode disposed on the substrate;
a drain electrode disposed on the substrate; and
a first metal gate finger disposed between the first source electrode and the drain electrode, and a second metal gate finger disposed between the drain electrode and the source electrode, the first and second metal gate fingers each comprising a metal T-gate having a width less than approximately 50 nm and greater than 0 nm.
2. The semiconductor device of claim 1 , wherein the substrate further comprises an indium phosphate substrate with an In 0.75 Ga 0.25 As channel.
3. The semiconductor device of claim 1 , wherein each of the first and second metal gate fingers comprises the metal T-gate comprising one of titanium, platinum and gold.
4. The semiconductor device of claim 1 , wherein each of the first and second metal gate fingers comprises the metal T-gate having a width of approximately 35 nm.
5. The semiconductor device of claim 1 , wherein each of the first and second metal gate fingers comprises the metal T-gate, wherein the metal T-gate includes sidewall portions composed of a dielectric material.