Differential head integrated touchdown sensors for hard disk drives
View Patent ↗A method and system for providing a disk drive is described. The disk drive includes media such as one or more disks, a slider, and a head residing on the slider. The head has an air-bearing surface (ABS), a portion of which contacts the media during touchdown. The head further includes a plurality of touchdown sensors. A first touchdown sensor is proximate to the ABS, while a second touchdown sensor is distal from the ABS. The touchdown sensors are capable of detecting a temperature change of 0.1 degree Celsius or, in some embodiments, smaller.
1. A disk drive comprising:
a slider;
a head residing on the slider and having an air-bearing surface (ABS), a portion of the ABS contacting a medium during a touchdown, the head further including a plurality of touchdown sensors, a first touchdown sensor proximate to the ABS, a second sensor distal from the ABS, the plurality of touchdown sensors capable of detecting a temperature change of 0.1 degree Celsius.
2. The disk drive of claim 1 wherein the first touchdown sensor is configured to sense a first temperature and the second touchdown sensor is configured to sense a second temperature, the disk drive further comprising:
differential circuitry coupled with the first touchdown sensor and the second touchdown sensor configured to determine a difference between the first temperature and the second temperature.
3. The disk drive of claim 2 further comprising
touchdown sensor control circuitry coupled with the plurality of touchdown sensors and including the differential circuitry, the touchdown sensor control circuitry for driving at least one current through the plurality of touchdown sensors and converting a signal from the differential circuitry to an indication of whether the touchdown has occurred.
4. The disk drive of claim 1 the first touchdown sensor is configured to sense a first temperature and the second touchdown sensor is configured to sense a second temperature, the disk drive further comprising:
further comprising differential circuitry for monitoring a difference between the first temperature and the second temperature.
5. The disk drive of claim 1 wherein at least one of the first touchdown sensor and the second touchdown sensor is a thermistor.
6. The disk drive of claim 5 wherein at least one of the first touchdown sensor and the second touchdown sensor includes a metal.
7. The disk drive of claim 5 wherein the at least one of the first and second touchdown sensors includes a first metal layer, and a second metal layer, a portion of the at least one amorphous semiconductor residing between a portion of the first metal layer and a portion of the second metal layer.
8. The disk drive of claim 1 wherein at least one of the first touchdown sensor and the second touchdown sensor includes at least one amorphous semiconductor.
9. The disk drive of claim 8 wherein the at least one amorphous semiconductor includes at least one of Ge, Si, GeSi, and GeSiO.
10. The disk drive of claim 1 wherein each of the plurality of touchdown sensors is capable of detecting the temperature change of 0.01 degree Celsius.
11. The disk drive of claim 1 wherein each of the plurality of touchdown sensors has a lateral dimension of not more than fifty microns.
12. The disk drive of claim 11 wherein the lateral dimension is not more than one micron.
13. The disk drive of claim 1 wherein each of the plurality of touchdown sensors has a thickness of not more than five hundred nanometers.
14. The disk drive of claim 1 wherein each of the plurality of touchdown sensors has a negative thermal coefficient of resistivity.
15. The disk drive of claim 1 wherein at least one of the first touchdown sensor and the second touchdown sensor has a positive thermal coefficient of resistivity.
16. A disk drive comprising:
a slider;
a head residing on the slider and having an air-bearing surface (ABS), a portion of the ABS contacting a medium during a touchdown, the head further including a first touchdown sensor proximate to the ABS and a second sensor distal from the ABS, the first touchdown sensor and the second touchdown sensor including at least one of amorphous Ge, Si, GeSi, and GeSiO, each of the first and second touchdown sensors further including a first metal layer, and a second metal layer, a portion of the at least one amorphous semiconductor residing between a portion of the first metal layer and a portion of the second metal layer, each of the first touchdown sensor and the second touchdown sensor capable of detecting a temperature change of 0.1 degree Celsius and having a lateral dimension of not more than one micron; and
differential circuitry coupled with the first touchdown sensor and the second touchdown sensor configured to determine a difference between the first temperature and the second temperature.
17. A method for detecting a touchdown between a head having an air-bearing surface (ABS) and a disk in a disk drive, the method comprising:
determining a first temperature of a first touchdown sensor integrated in the head, the first touchdown sensor being proximate to the ABS and capable of detecting a temperature change of 0.1 degree Celsius;
determining a second temperature of a second touchdown sensor integrated in the head, the second touchdown sensor being distal from the ABS and capable of detecting the temperature change;
calculating a difference between the first temperature and the second temperature; and
detecting the touchdown based on the difference.
18. The method of claim 17 wherein the step of detecting further includes:
detecting the touchdown if the difference is at least a threshold.
19. The method of claim 17 wherein the step of detecting further includes:
detecting the touchdown if a change in a rate of change of temperature is at least a threshold.
20. The method of claim 17 wherein at least one of the first touchdown sensor and the second touchdown sensor is a thermistor.
21. The method of claim 17 wherein at least one of the first touchdown sensor and the second touchdown sensor includes at least one amorphous semiconductor.
22. The method of claim 21 wherein the at least one amorphous semiconductor includes at least one of Ge, Si, GeSi, and GeSiO.
23. The method of claim 21 wherein the at least one of the first and second touchdown sensors includes a first metal layer, and a second metal layer, a portion of the at least one amorphous semiconductor residing between a portion of the first metal layer and a portion of the second metal layer.
24. The method of claim 17 wherein at least one of the first touchdown sensor and the second touchdown sensor includes a temperature sensitive metal.
25. The method of claim 17 wherein the first touchdown sensor has a first negative thermal coefficient of resistivity and the second touchdown sensor has a second negative thermal coefficient of resistivity.