Micro-electromechanical nozzles having low weight heater elements
View Patent ↗Provided is a pagewidth printhead having a plurality of micro-electromechanical nozzle arrangements. Each nozzle arrangement includes side walls located on a wafer substrate with a roof portion attached to said walls to define a printing fluid chamber. The roof portion defines an ejection port. Each nozzle arrangement also includes an inlet defined in the substrate to supply the fluid chamber with printing fluid, and at least one heater element having a mass of less than 10 nanograms suspended between the side walls in the fluid chamber. In operation, when electrical actuation energy of less than 500 nanojoules is applied to the heater element, the printing fluid undergoes thermal cavitation which increases fluid pressure in the chamber thereby ejecting printing fluid from the ejection port.
1. A printhead having a plurality of micro-electromechanical nozzles, each nozzle comprising:
a fluid chamber for holding printing fluid, the fluid chamber having side walls located on a wafer substrate and a roof portion attached to said side walls, the roof portion defining an ejection port; and
a heater element suspended between the side walls in the fluid chamber, the heater element having a mass of less than 10 nanograms and upon application of electrical energy of less than 500 nanojoules to the heater element, a vapour bubble is formed in the printing fluid, thereby ejecting the fluid via the ejection port, said heater element being configured so that a point of collapse of the bubble is distal therefrom.
2. The printhead of claim 1 wherein each nozzle further comprises a fluid inlet defined in the wafer substrate for supplying the fluid chamber with printing fluid.
3. The printhead of claim 1 , wherein the heater element has an annular shape with the point of collapse of the bubble near a centre thereof.
4. The printhead of claim 1 , wherein said mass of the heater element is less than 2 nanograms.
5. The printhead of claim 1 , wherein said mass of the heater element is less than 500 picograms.
6. The printhead of claim 1 , wherein said mass of the heater element is less than 250 picograms.
7. The printhead of claim 1 , having a nozzle density of more than 10,000 nozzles per square cm of substrate surface.
8. The printhead of claim 1 , wherein each nozzle further comprises a CMOS driving layer for driving the heater element.