IP Library Granted Patent US 9,198,232
Granted Patent B2
US 9,198,232 · App. 12/437,535 · Granted Nov 24, 2015

Nanostructure-based heating devices and methods of use

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Quick Facts
Patent No.
US 9,198,232
App. No.
12/437,535
Granted
Nov 24, 2015
Kind
B2
Abstract

A heating device having a thermally conducting member made from a matrix of carbon nanotubes and having opposing ends. A connector portion can be positioned at each end of the conducting member, and can be capable of receiving a current from an external source to permit the conducting member to generate heat. A coupling mechanism can be included and associated with the connector portion so as to provide the connector portion with substantially uniform contact across a contact surface area with the conducting member. Methods of using the heating device are also disclosed.

Claims (33)

1. A heating device comprising:

a thermally conducting member having opposing ends and made from a non-woven sheet of carbon nanotubes, the non-woven sheet having a first and a second surface and a plurality of continuous layers situated on top of one another therebetween, the carbon nanotubes of the non-woven sheet being sufficiently intermingled with one another such that an adequate number of contact sites exists to provide the necessary bonding strength between the intermingled nanotubes to form a continuous structure, and being able to support itself structurally independent of the assistance of a substrate or binder;

a connector portion, positioned at each end of the conducting member, for receiving a current from an external source to permit the conducting member to generate heat; and

a conductive coupling mechanism, separate from the thermally conductive member, disposed on a surface of the thermally conducting member and sandwiched between the connector portion and the thermally conducting member so as to enhance conductive contact between the thermally conducting member and the connector portion.

2. A heating device as set forth in claim 1 , further including a thermally conductive body coupled to the conducting member so as to permit expansion of a heating zone of the conducting member.

3. A heating device as set forth in claim 2 , wherein the thermally conductive body is made from one of a metal, a metal alloy, any other thermally conductive material or a combination thereof.

4. A heating device as set forth in claim 1 , further including a resin material incorporated and dispersed throughout the conducting member.

5. A heating device as set forth in claim 1 , further including an insulating component so as to minimize leakage of current from the device.

6. A heating device as set forth in claim 1 , wherein the heating device is designed to be coupled to another device, structure or component to provide heat thereto.

7. A heating device as set forth in claim 1 , wherein the heating device is designed to be embedded within a device, structure or component to provide heat thereto.

8. A heating device as set forth in claim 1 , wherein the heating device is designed to be coupled to or embedded within a device, structure or component including one of a satellite, satellite housing, other satellite parts or components, fuel lines, rockets, spacecrafts, airplanes, automobiles, batteries, motors, or any other structures or components in need of being heated.

9. A heating device as set forth in claim 8 for use in connection with de-icing of a structure, device or component.

10. A method comprising:

providing a heater having 1) a thermally conducting member having opposing ends and made from a non-woven sheet of carbon nanotubes, the non-woven sheet having a first and a second surface and a plurality of continuous layers situated on top of one another therebetween, the carbon nanotubes of the non-woven sheet being sufficiently intermingled with one another such that an adequate number of contact sites exists to provide the necessary bonding strength between the intermingled nanotubes to form a continuous structure, and being able to support itself structurally independent of the assistance of a substrate or binder, 2) a connector portion positioned at each end of the conducting member capable of receiving a current from an external source to permit the conducting member to generate heat, and 3) a conductive coupling mechanism, separate from the thermally conductive member, disposed on a surface of the thermally conducting member and sandwiched between the connector portion and the thermally conducting member so as to enhance substantially uniform conductive contact across a contact surface area between the thermally conducting member and the connector portion;

attaching the heater to a device, structure, or component in need of being heated;

directing a current to the heater through the connector portion and the coupling mechanism so the conducting member generates heat; and

heating the device, structure, or component to desired levels.

11. The method of claim 10 , further comprising expanding the conducting member of the heater to accommodate thermal expansion of the device, structure, or component during heating.

12. The method of claim 10 , wherein attaching the heater includes coupling the heater to an interior surface of the device, structure, or component.

13. The method of claim 10 , wherein attaching the heater includes coupling the heater to an exterior surface of the device, structure, or component.

14. The method of claim 10 , wherein attaching the heater includes embedding the heater into the device, structure, or component.

15. The method of claim 10 , wherein directing a current to the heater includes connecting a power source to the connector portion of the heater.

16. The method of claim 10 wherein heating the device, structure, or component includes de-icing the device, structure, or component.

17. The heating device of claim 1 , wherein the conducting member, the connecting portion and the coupling mechanism form a unitary structure.

18. A heating device, comprising:

a thermally conducting member having opposing ends and made from a non-woven sheet of carbon nanotubes, the non-woven sheet having a first and a second surface and a plurality of continuous layers situated on top of one another therebetween, the carbon nanotubes of the non-woven sheet being sufficiently intermingled with one another such that an adequate number of contact sites exists to provide the necessary bonding strength between the intermingled nanotubes to form a continuous structure, and being able to support itself structurally independent of the assistance of a substrate or binder

a connector portion disposed at each end of the thermally conducting member, the connector portion designed to receive a current from an external source and transmitting the received current to the thermally conducting member so that the thermally conducting member generates heat; and

a conductive coupling mechanism, separate from the thermally conductive member, disposed on a surface of the thermally conducting member and sandwiched between the connector portion and the thermally conducting member so as to enhance conductive contact between the thermally conducting member and the connector portion.

19. The heating device of claim 18 , further comprising:

a thermally conductive body

wherein the thermally conductive body is coupled to the thermally conducting member and configured so as to accommodate expansion of the thermally conducting member.

20. The heating device of claim 18 , wherein the thermally conducting member further comprises a resin material that is incorporated into and dispersed throughout the matrix of carbon nanotubes forming the thermally conducting member.

21. The heating device of claim 18 , wherein when the coupling mechanism and the connector portion are disposed on the thermally conducting member, the resultant is a self-supporting unitary structure.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Jul 28, 2026
From: SECTOR CAPITAL GROUP, LLC
To: HUNTSMAN NANOCOMP LLC
Reel/Frame 075425/0284 →
RELEASE OF SECURITY INTEREST Recorded Jul 28, 2026
From: PIVOTAL CAPITAL FUND, LP
To: HUNTSMAN NANOCOMP LLC
Reel/Frame 075425/0272 →
SECURITY INTEREST Recorded May 4, 2026
From: HUNTSMAN INTERNATIONAL LLC; HUNTSMAN ADVANCED MATERIALS AMERICAS LLC; HUNTSMAN NANOCOMP LLC; HUNTSMAN PETROCHEMICAL LLC
To: CITIBANK N.A.
Reel/Frame 075498/0663 →
PATENT SECURITY AGREEMENT Recorded Mar 10, 2026
From: HUNTSMAN INTERNATIONAL LLC; HUNTSMAN ADVANCED MATERIALS AMERICAS LLC; HUNTSMAN NANOCAMP LLC; HUNTSMAN PETROCHEMICAL LLC
To: CITIBANK, N.A.
Reel/Frame 075106/0238 →
SECURITY INTEREST Recorded Jan 21, 2018
From: NANOCOMP TECHNOLOGIES, INC.
To: SECTOR CAPITAL GROUP, LLC
Reel/Frame 044683/0242 →
RELEASE OF SECURITY INTEREST Recorded May 12, 2017
From: HORIZON TECHNOLOGY FINANCE CORPORATION
To: NANOCOMP TECHNOLOGIES, INC.
Reel/Frame 042364/0414 →
SECURITY INTEREST Recorded May 12, 2017
From: NANOCOMP TECHNOLOGIES, INC.
To: PIVOTAL CAPITAL FUND, LP
Reel/Frame 042364/0279 →
SECURITY INTEREST Recorded Apr 8, 2016
From: NANOCOMP TECHNOLGIES, INC.
To: HORIZON TECHNOLOGY FINANCE CORPORATION
Reel/Frame 038231/0494 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2009
From: LASHMORE, DAVID S.; TIMONEY, CORY
To: NANOCOMP TECHNOLOGIES, INC.
Reel/Frame 022984/0771 →