IP Library Granted Patent US 7,939,848
Granted Patent B2
US 7,939,848 · App. 12/438,069 · Granted May 10, 2011

LED package

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Quick Facts
Patent No.
US 7,939,848
App. No.
12/438,069
Granted
May 10, 2011
Kind
B2
Abstract

The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.

Claims (14)

1. An LED package, comprising:

a lead frame comprising a chip attaching portion comprising at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion; and

a housing for supporting the lead frame,

wherein the plurality of terminal portions comprise at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion,

wherein the lead frame comprises a moisture shield arranged on a surface thereof,

wherein the moisture shield comprises a wall protruding from the surface of the lead frame and contacting the housing.

2. The LED package as claimed in claim 1 , wherein the plurality of terminal portions comprise two first terminal portions extending from one side of the chip attaching portion and two second terminal portions spaced apart from the other side of the chip attaching portion.

3. The LED package as claimed in claim 1 , wherein the moisture shield further comprises a hole formed in the lead frame in which a portion of the housing is arranged.

4. The LED package as claimed in claim 1 , wherein the housing comprises a cavity in which an encapsulant is disposed, and a moisture shielding wall contacting the encapsulant and arranged in an inner wall of the cavity.

5. The LED package as claimed in claim 1 , wherein each terminal portion comprises a bent portion arranged near an external surface of the housing, and the bent portion comprises a V-shaped notch.

6. The LED package as claimed in claim 1 , wherein the plurality of terminal portions comprise one first terminal portion extending from the chip attaching portion and three second terminal portions spaced apart from the chip attaching portion.

7. The LED package as claimed in claim 1 , wherein the plurality of terminal portions comprise a width approximately half that of the chip attaching portion.

8. The LED package as claimed in claim 1 , wherein at least one terminal portion extends from an inside part of the housing to an outside part of the housing.

9. The LED package as claimed in claim 4 , wherein the inner wall of the cavity is inclined, and the moisture shielding wall protrudes from the inclined inner wall of the cavity.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2024
From: SEOUL SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 069400/0867 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2009
From: KIM, DO HYUNG; KANG, SUK JIN
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 022395/0794 →