IP Library Granted Patent US 8,153,354
Granted Patent B2
US 8,153,354 · App. 12/438,185 · Granted Apr 10, 2012

Sealed cell structure

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Quick Facts
Patent No.
US 8,153,354
App. No.
12/438,185
Granted
Apr 10, 2012
Kind
B2
Abstract

A method for forming a sealed cell structure is disclosed. The sealed cell structure comprises first ( 10 ) and second ( 12 ) substrates that are spaced apart by a plurality of partition walls ( 14 ). The partition walls define a plurality of cells ( 18, 19 ) between the first and second substrates. At least one of the substrates and the partition walls have a layer ( 16, 22, 30 ) of photo-embossing material on them. A latent image is written ( 112 ) onto the photo-embossing material, and then the image is developed, thereby causing expansion of the photo-embossing material in the areas ( 114 ) according to the pattern of the latent image. The expansion of the photo-embossing material causes the cells to be sealed apart from one another.

Claims (58)

1. A method for forming a sealed cell structure, the sealed cell structure comprising first and second substrates and a plurality of partition walls, the method comprising:

applying photo-embossing material on at least one of:

the first substrate;

the second substrate; and

the plurality of partition walls;

spacing the first and second substrates apart by the plurality of partition walls, thereby defining a plurality of cells between the first and second substrates;

writing a latent image into the photo-embossing material; and

developing the latent image, causing the photo-embossing material to expand and be displaced so as to seal the cells apart from one another.

2. A method according to claim 1 , further comprising filling the cells with fluid prior to sealing them apart from one another.

3. A method according to claim 2 , wherein the fluid is an electrophoretic fluid, and wherein the cells form pixels of an electrophoretic display.

4. A method according to claim 1 , wherein writing the latent image comprises exposing one or more areas of the photo-embossing material to actinic light.

5. A method according to claim 1 , wherein developing the latent image comprises heating the photo-embossing material.

6. A method according to claim 1 , wherein the photo-embossing material comprises a polymer, a monomer, and a photo-initiator.

7. A method according to claim 6 , wherein writing the latent image comprises exposing areas of the photo-embossing material to actinic light, and wherein developing the latent image comprises heating the photo-embossing material, causing displacement of the monomer to the exposed areas, thereby expanding the exposed areas to seal the cells apart from one another.

8. A method according to claim 7 , wherein the photo-embossing material further comprises a thermal initiator, and wherein developing the photo-embossing material comprises heating the photo-embossing material above the decomposition temperature of the thermal initiator, thereby polymerising the monomer.

9. A method according to claim 1 , wherein the writing the latent image is performed after the spacing the first and second substrates apart from one another by the partition walls.

10. A method according to claim 9 , wherein the latent image is written by exposing areas of the photo-embossing material to actinic light, wherein the cells are filled with a fluid comprising particles that absorb the actinic light, and wherein the absorbing particles act as a mask that at least partially defines the pattern of the latent image that is written onto the photo-embossing material.

11. A method according to claim 1 , wherein the spacing the first and second substrates apart by a plurality of partition walls comprises:

forming the partition walls on the first substrate; and

laying the second substrate on the partition walls.

12. A method according to claim 1 , wherein the photo-embossing material is formed as a layer on at least one of the first and second substrates, and wherein the writing and the developing of the latent image causes the photo-embossing material to be displaced so as to contact the partition walls, thereby sealing the cells apart from one another.

13. A method according to claim 1 , wherein the photo-embossing material is formed:

on at least one of the first and second substrates; and

within the regions of the interfaces between the partition walls and the at least one of the first and second substrates; and

wherein the writing and the developing of the latent image causes the photo-embossing material to be displaced so as to contact the partition walls, thereby sealing the cells apart from one another.

14. A method according to claim 1 , wherein the photo-embossing material is formed:

on the partition walls; and

within the regions of the interfaces between the partition walls and at least one of the first and second substrates; and

wherein the writing and the developing of the latent image causes the photo-embossing material to be displaced so as to contact the at least one of the first and second substrates, thereby sealing the cells apart from one another.

15. A method according to claim 1 , wherein the spacing the first and second substrates apart by a plurality of partition walls comprises:

forming the partition walls on the first substrate; and

laying the second substrate on the partition walls; and

wherein prior to the laying the second substrate on the partition walls, the photo-embossing material is formed:

on the second substrate, and

on the partition walls, within the regions of the partition walls that will form the interfaces between the partition walls and the second substrate; and

wherein the writing and the developing of the latent image causes:

the photo-embossing material on the second substrate to be displaced towards the partition walls; and

the photo-embossing material on the partition walls to be displaced towards the second substrate;

such that the photo-embossing material on the second substrate contacts the photo-embossing material on the partition walls, thereby sealing the cells apart from one another.

16. A method according to claim 12 , wherein the spacing the first and second substrates apart by a plurality of partition walls comprises:

forming the partition walls on the first substrate; and

laying the second substrate on the partition walls; and

wherein the photo-embossing material is formed on the second substrate prior to laying the second substrate over the partition walls, and wherein the writing and developing of the latent image causes the photo-embossing material on the second substrate to be displaced so as to expand towards and to contact the plurality of partition walls, thereby sealing the cells apart from one another.

17. A method according to claim 12 , wherein the spacing the first and second substrates apart by a plurality of partition walls comprises:

forming the partition walls on the first substrate; and

laying the second substrate on the partition walls; and

wherein the photo-embossing material is formed on the first substrate prior to forming the partition walls on the first substrate, and wherein the writing and developing of the latent image causes the photo-embossing material on the first substrate to be displaced so as to press against the plurality of partition walls, thereby displacing the plurality of partition walls so as to contact them against the second substrate, and thereby sealing the cells apart from one another.

18. A method according to claim 14 , wherein the spacing the first and second substrates apart by a plurality of partition walls comprises:

forming the partition walls on the first substrate; and

laying the second substrate on the partition walls; and

wherein the photo-embossing material is formed:

on the plurality of partition walls, prior to the laying the second substrate on the partition walls; and

within the regions of the partition walls that will form the interfaces between the partition walls and the second substrate; and

wherein the writing and developing of the latent image causes the photo-embossing material on the partition walls to be displaced so as to expand towards and to contact the second substrate, thereby sealing the cells apart from one another.

19. A method according to claim 1 , wherein the cells of the sealed cell structure form pixels of an electrophoretic display.

20. A method according to claim 1 , wherein the photo-embossing material comprises:

an inner material in which the latent image is written and developed; and

an outer protective layer at the surface of the inner material, the outer protective layer being able to deform in accordance with the inner material during the development of the latent image.

Assignments (6)
CHANGE OF NAME Recorded Oct 28, 2019
From: PHILIPS LIGHTING HOLDING B.V.
To: SIGNIFY HOLDING B.V.
Reel/Frame 050837/0576 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED ON REEL 037732 FRAME 0347. ASSIGNOR(S) HEREBY CONFIRMS THE APP. NO. 14/553248 SHOULD BE APP. NO. 14/553258. Recorded Oct 11, 2016
From: SCHAEFFLER TECHNOLOGIES GMBH & CO. KG
To: SCHAEFFLER TECHNOLOGIES AG & CO. KG
Reel/Frame 040404/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2016
From: KONINKLIJKE PHILIPS N.V.
To: PHILIPS LIGHTING HOLDING B.V.
Reel/Frame 040060/0009 →
CHANGE OF NAME Recorded Jul 22, 2016
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 039428/0606 →
MERGER AND CHANGE OF NAME Recorded Feb 5, 2016
From: SCHAEFFLER TECHNOLOGIES AG & CO. KG; SCHAEFFLER VERWALTUNGS 5 GMBH
To: SCHAEFFLER TECHNOLOGIES GMBH & CO. KG
Reel/Frame 037732/0228 →
CHANGE OF NAME Recorded Feb 5, 2016
From: SCHAEFFLER TECHNOLOGIES GMBH & CO. KG
To: SCHAEFFLER TECHNOLOGIES AG & CO. KG
Reel/Frame 037732/0347 →